Saint-Égrève, France

Francois Rieutord

This inventor holds 8 USPTO granted patents and 1 published patent application. Top assignees: Commissariat a L'energie Atomique Et Aux Energies Alternatives, Soitec. Active years: 2010-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Francois Rieutord. Retrieved from https://idiyas.com/inventor/francois-rieutord

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 8 

% Patents Active = 75.0

Average Co-Inventor Count = 2.4

ph-index = 2

Forward Citations = 9(Granted Patents)


Location History:

  • St. Egreve, FR (2010)
  • Saint Egreve, FR (2010 - 2021)

Company Filing History:


Years Active: 2010-2021

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8 patents (USPTO):Explore Patents

Title: Inventor François Rieutord: Innovations in Substrate Bonding

Introduction

François Rieutord is a distinguished inventor located in Saint Egrève, France, with an impressive portfolio of 8 patents. His innovative work primarily focuses on advanced methods of substrate bonding and layering techniques that have wide applications in various technological fields.

Latest Patents

Among François Rieutord's latest patents is a groundbreaking method for transferring a useful layer. This method involves creating an embrittlement plane by implanting light elements into a first substrate. A useful layer is then formed between this plane and one surface of the substrate. The technique includes applying a support to the surface, creating an assembly that is subsequently fractured through a heat treatment, initiating a fracture wave along the embrittlement plane. Notably, the speed of the fracture wave is controlled to ensure that vibrations remain localized to the peripheral area of the useful layer.

Another recent patent by Rieutord centers on the direct bonding of substrates, which includes thinning the edges of at least one substrate. This method involves thinning the edges of the first substrate and placing it in contact with the second substrate to facilitate direct bonding. A bonding wave propagates between the substrates, creating a secure attachment where the thinned portions of the first substrate adhere to the second substrate effectively.

Career Highlights

François Rieutord has contributed significantly to the field of material science through his work at prestigious organizations, including the Commissariat à l'Énergie Atomique et aux Énergies Alternatives and the Commissariat à l'Énergie Atomique. His expertise and innovative approaches have enabled the development of new techniques in substrate bonding that could transform various technological applications.

Collaborations

Throughout his career, Rieutord has worked alongside notable colleagues such as Hubert Moriceau and Shay Reboh. These collaborations have further enhanced his research and development efforts, fostering a creative environment that promotes innovative solutions.

Conclusion

François Rieutord’s contributions to substrate bonding methods exemplify the spirit of innovation that drives technological advancement. His patents not only reflect his dedication to material science but also pave the way for future innovations in the field. With a strong foundation in research and collaborations, Rieutord continues to be a prominent figure in the realm of inventions and patents.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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