The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2013

Filed:

Oct. 14, 2011
Applicants:

Remi Beneyton, Grenoble, FR;

Hubert Moriceau, Saint Egreve, FR;

Frank Fournel, Villard-Bonnot, FR;

Francois Rieutord, Saint Egreve, FR;

Yannick Le Tiec, Crolles, FR;

Inventors:

Remi Beneyton, Grenoble, FR;

Hubert Moriceau, Saint Egreve, FR;

Frank Fournel, Villard-Bonnot, FR;

Francois Rieutord, Saint Egreve, FR;

Yannick Le Tiec, Crolles, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to a process for producing a bond between a first and a second substrate. The process includes preparing surfaces of the substrates to be assembled, and attaching the surfaces to form an assembly of these two surfaces, by direct molecular bonding. The assembly is then heat treated, which includes maintaining the temperature within the range of 50° C. to 100° C. for at least one hour.


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