Feng Wei Kuo

This inventor holds 106 USPTO granted patents and 7 published patent applications, primarily in Photonics Integration (CPC class H01L23-66). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Global Unichip Corporation, University of California. Active years: 2012-2026.

USPTO Granted Patents = 106 (Patent Applications = 7)

% Patents Active = 87.7

Average Co-Inventor Count = 4.2

ph-index = 10

Forward Citations = 358(Granted Patents)

Forward Citations (Not Self Cited) = 282(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Zhudong Township, Hsinchu County, TW (2012 - 2024)
Zhudong Township, TW (2013 - 2024)
Hsinchu, TW (2015 - 2024)
Hsinchu County, TW (2018 - 2024)

Company Filing History:

106 out of 42,679

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

2 out of 244

Global Unichip Corporation

patents

2 out of 15,964

University of California

patents

4. 1 out of 1,388

National Taiwan University

patents

where one patent can have more than one assignee

Years Active: 2012-2026

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Areas of Expertise:

Multiband QAM Interface

Photonics Integrated Circuit

Integrated Circuit Stack

Shielded Inductive Devices

3D Magnetic Core Inductor

Optical Device Manufacturing

Radio Frequency Interconnect

High Isolation Cross Coupling

3D IC Antenna Array

Channel Loss Compensation

All-Digital Phase Locked Loop

Wireless Interactions

106 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12616033 - Multiband QAM interface for slab waveguide (2026-04-28),

2. 12293974 - Photonics integrated circuit package (2025-05-06),

3. 12293141 - Integrated circuit stack verification method and system for performing the same (2025-05-06),

4. 12278259 - Systems and methods for shielded inductive devices (2025-04-14),

5. 12272637 - Integrated fan-out package with 3D magnetic core inductor (2025-04-08),

6. 12153253 - Optical device and method of manufacturing the same (2024-11-26),

7. 12095711 - Integrated circuit with radio frequency interconnect (2024-09-17),

8. 12074125 - Coaxial through via with novel high isolation cross coupling method for 3D integrated circuits (2024-08-27),

9. 12062629 - Multiband QAM interface for slab waveguide (2024-08-13),

10. 12018981 - Polarization independent optoelectronic device and method (2024-06-25),

11. 11935837 - Photonics integrated circuit package (2024-03-19),

12. 11804515 - Systems and methods for shielded inductive devices (2023-10-31),

13. 11803008 - Optical device and method of manufacturing the same (2023-10-31),

14. 11703379 - Polarization independent optoelectronic device and method (2023-07-18),

15. 11688685 - Integrated fan-out package with 3D magnetic core inductor (2023-06-27),

Title: The Innovative Journey of Inventor Feng Wei Kuo

Introduction: Feng Wei Kuo, a talented inventor hailing from Zhudong, Taiwan, has made significant contributions to the field of innovations with his creative mind and dedication to progress.

Latest Patents: Feng Wei Kuo's latest patents showcase his commitment to pushing boundaries in technology and design, with a focus on improving everyday life through his inventions.

Career Highlights: Throughout his illustrious career, Feng Wei Kuo has been recognized for his groundbreaking work in various industries, earning accolades for his innovative solutions and forward-thinking approach.

Collaborations: Feng Wei Kuo has collaborated with leading companies and research institutions to bring his inventions to life, fostering a culture of innovation and excellence in every project he undertakes.

Conclusion: In conclusion, Feng Wei Kuo stands as a shining example of an inventor who continues to inspire and drive change through his relentless pursuit of innovation and passion for creating a better future for all.