The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2023

Filed:

Jan. 26, 2022
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Feng Wei Kuo, Hsinchu County, TW;

Chewn-Pu Jou, Hsinchu, TW;

Huan-Neng Chen, Hsin-Chu, TW;

Lan-Chou Cho, Hsinchu, TW;

Robert Bogdan Staszewski, Dublin, IE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H03L 7/085 (2006.01); H01L 49/02 (2006.01); H01F 27/28 (2006.01); H03L 7/099 (2006.01); B01D 1/00 (2006.01); B01D 1/12 (2006.01); C02F 1/04 (2023.01); C02F 11/12 (2019.01); C02F 11/18 (2006.01); C02F 101/30 (2006.01); C02F 103/14 (2006.01); C02F 103/16 (2006.01); C02F 103/28 (2006.01); C02F 103/32 (2006.01); C02F 103/34 (2006.01); C02F 103/36 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); B01D 1/0017 (2013.01); B01D 1/12 (2013.01); C02F 1/048 (2013.01); C02F 11/12 (2013.01); C02F 11/18 (2013.01); H01F 27/2885 (2013.01); H01L 23/5227 (2013.01); H03L 7/085 (2013.01); H03L 7/099 (2013.01); C02F 2101/301 (2013.01); C02F 2101/306 (2013.01); C02F 2103/14 (2013.01); C02F 2103/16 (2013.01); C02F 2103/28 (2013.01); C02F 2103/32 (2013.01); C02F 2103/343 (2013.01); C02F 2103/365 (2013.01); H03L 2207/50 (2013.01);
Abstract

In an embodiment, a circuit includes: a transformer defining an inductive footprint within a first layer; a grounded shield bounded by the inductive footprint within a second layer separate from the first layer; and a circuit component bounded by the inductive footprint within a third layer separate from the second layer, wherein: the circuit component is coupled with the transformer through the second layer, and the third layer is separated from the first layer by the second layer.


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