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Hsinchu, Taiwan

Global Unichip Corporation

USPTO Granted Patents = 244

% Expired Patents = 5.7

Trademarks = 2

Forward Citations = 570

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224 inventors (with patents filed for the assignee):

Ting-Hao Wang (33 out of 33 patents)

Wen-Juh Kang (25 out of 25 patents)

Igor Elkanovich (23 out of 23 patents)

4. Chih-Chieh Liao (22 out of 22 patents)

5. Yu-Min Sun (22 out of 22 patents)

6. Chih-Feng Cheng (22 out of 22 patents)

7. Yu-Chu Chen (18 out of 22 patents)

8. Yung-Sheng Fang (16 out of 17 patents)

9. Sheng-Fan Yang (15 out of 15 patents)

10. Ting-Hsu Chien (15 out of 15 patents)

11. Wen-Tai Wang (15 out of 26 patents)

12. Yen-Chung Chen (14 out of 32 patents)

13. Pei Yu (13 out of 14 patents)

14. Min-Hsiu Tsai (12 out of 13 patents)

15. Tsai-Ming Yang (10 out of 10 patents)

Core Competencies:

Semiconductor Packaging

Temperature Sensing

Communication Systems

Chip Characteristics

Testing Apparatus

Power Distribution

Analog-to-Digital Converter

Interposer Device

Signal Transmission

3D Semiconductor

Electrostatic Discharge Protection

Circuit Board Device

244 patents: Sort by Forward Citations

1. 12724448 - Semiconductor device, interface device and operation method (2026-09-01),

2. 12685198 - Semiconductor chiplet device and interposer (2026-07-14),

3. 12645625 - Semiconductor device and operation method thereof (2026-06-02),

4. 12609678 - Semiconductor device, interface device and operation method (2026-04-21),

5. 12607523 - Temperature sensing device and calibration method thereof (2026-04-21),

6. 12603409 - High-frequency transmission element (2026-04-14),

7. 12583661 - Chip storing device (2026-03-24),

8. 12525502 - Semiconductor packaging device and heat dissipation cover thereof (2026-01-13),

9. 12510589 - Method of measuring chip characteristics, test device and non-transitory computer readable media (2025-12-30),

10. 12506057 - Interposer device and semiconductor package structure (2025-12-23),

11. 12484149 - Electric device, its circuit board and method of manufacturing the electric device (2025-11-25),

12. 12461150 - Testing circuit (2025-11-04),

13. 12446145 - Circuit board device and its circuit module (2025-10-14),

14. 12438654 - Communication system between dies and repairing method for lanes between dies (2025-10-07),

15. 12422481 - Semiconductor chip and sequence checking circuit (2025-09-23),

Global Unichip Corporation, headquartered in Hsinchu, Taiwan, specializes in the design and manufacturing of advanced semiconductor devices. The company focuses on various core technology areas, including semiconductor packaging, temperature sensing, and communication systems. Their expertise extends to chip characteristics, testing apparatus, power distribution, and analog-to-digital converters, as well as interposer devices. Global Unichip is committed to delivering innovative solutions that meet the evolving needs of the semiconductor industry.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

244 Patents

#37 in Hsinchu

#119 in Taiwan

#3,548 in the World

Hsinchu, Taiwan

Global Unichip Corporation

Forward Citations = 570

224 inventors:

Ting-Hao Wang (33 out of 33 patents)

Wen-Juh Kang (25 out of 25 patents)

Igor Elkanovich (23 out of 23 patents)

4. Chih-Chieh Liao (22 out of 22 patents)

5. Yu-Min Sun (22 out of 22 patents)

Please report any incorrect information to [email protected]

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