The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2026

Filed:

Jan. 14, 2025
Applicants:

Global Unichip Corporation, Hsinchu, TW;

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chia-Hsiang Chang, Hsinchu, TW;

Igor Elkanovich, Hsinchu, TW;

Wen-Lung Tu, Hsinchu, TW;

Chao-Hsin Fan Jiang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/36 (2006.01);
U.S. Cl.
CPC ...
G06F 13/36 (2013.01); G06F 2213/40 (2013.01);
Abstract

The semiconductor device includes a first die and a second die. The first die includes a first clock tree circuit and a first data channel. An output terminal of the first clock tree circuit is coupled to a trigger terminal of the first data channel. The second die includes a second clock tree circuit, and a second data channel. An input terminal of the second clock tree circuit is coupled to the first die through a clock interconnect to receive a source clock signal. An output terminal of the second clock tree circuit is coupled to a trigger terminal of the second data channel. An input terminal of the second data channel is coupled to an output terminal of the first data channel through a data interconnect.


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