Eun Sook Sohn

Title: **Innovations by Eun Sook Sohn: Pioneering Electronic Package Structures**

Introduction

Eun Sook Sohn, an accomplished inventor based in Seoul, South Korea, has made significant contributions to the field of electronic packaging. With a remarkable portfolio of 12 patents, she has demonstrated her expertise in developing innovative solutions that enhance the reliability and efficiency of electronic devices.

Latest Patents

Eun Sook Sohn's latest patents focus on advanced electronic package structures. One of her notable inventions is an electronic package structure with reduced vertical stress regions. This method involves designing a substrate that features a die pad with both a top and bottom surface, along with laterally spaced leads. The substrate encapsulant plays a crucial role, ensuring that the die pad and leads protrude outward from the substrate's bottom surface, ultimately improving device connection and reliability.

Another significant patent is her electronic package structure that boasts improved board-level reliability. This structure also features a substrate with a die pad and leads, which are designed to assist in the effective connection of electronic devices. By maintaining a deliberate spacing between the electronic device and the substrate's surfaces, the invention promotes a robust integration of components that can withstand stress during operation.

Career Highlights

Throughout her career, Eun Sook Sohn has worked for prominent companies in the electronics industry, including Amkor Technology and Amkor Technology Singapore Holding. Her roles at these organizations have allowed her to gain invaluable experience and insight into the challenges and innovations within the field of electronic packaging.

Collaborations

In her journey of innovation, Eun Sook Sohn has collaborated with talented professionals such as Jong Sik Paek and Won Chul Do. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies, significantly impacting the advancement of electronic packaging solutions.

Conclusion

Eun Sook Sohn stands out as a leading inventor whose work has paved the way for advancements in electronic package structures. Her innovative patents and collaborative spirit within the industry exemplify her commitment to enhancing the reliability and performance of electronic devices, marking her as a key figure in the field.