The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2012
Filed:
Feb. 25, 2008
Applicant:
Eun Sook Sohn, Seoul, KR;
Inventor:
Eun Sook Sohn, Seoul, KR;
Assignee:
Amkor Technology, Inc., Chandler, AZ (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package assembly has a first semiconductor package. A plurality of first solder balls is attached to the first semiconductor package. A circuit board is provided having a plurality of mounting pads that is electrically connected to the plurality of first solder balls. A first underfill is disposed on each of the plurality of first solder balls. The first underfill is disposed on interfaces between each of the plurality of first solder balls and the first semiconductor package and each of the plurality of first solder balls and the circuit board. The first underfill is removed from an area between adjacent first solder balls.