The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2011
Filed:
Feb. 23, 2009
Bong Chan Kim, Seongnam-si, KR;
DO Hyung Kim, Sunpo-si, KR;
Chan Ha Hwang, Anyang-si, KR;
Min Woo Lee, Mapo-gu, KR;
Eun Sook Sohn, Sungdong-gu, KR;
Won Joon Kang, Seodaemun-gu, KR;
Bong Chan Kim, Seongnam-si, KR;
Do Hyung Kim, Sunpo-si, KR;
Chan Ha Hwang, Anyang-si, KR;
Min Woo Lee, Mapo-gu, KR;
Eun Sook Sohn, Sungdong-gu, KR;
Won Joon Kang, Seodaemun-gu, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
In accordance with the present invention, there is provided multiple embodiments of a reduced profile stackable semiconductor package. The semiconductor package comprises a substrate having at least one semiconductor die attached thereto. The semiconductor die is also electrically connected to the substrate by a plurality of conductive wires. A package body defining opposed top and bottom surfaces and a side surface at least partially encapsulates the substrate, the conductive wires and the semiconductor die. The package body is formed such that at least portions of the conductive wires are exposed in the top surface thereof. The package body may include a groove formed in the top surface thereof, with at least portions of the conductive wires being exposed in the groove. In this instance, conductive material layers may be disposed within the groove and electrically connected to the exposed portions of respective ones of the conductive wires, with solder pads further bring electrically connected to respective ones of the conductive material layers and at least partially residing within the groove.