Bong Chan Kim

USPTO Granted Patents = 23 (Patent Applications = 8)

CIPO Patents = 5

EPO Patents = 9 (Patent Applications = 14)

Average Co-Inventor Count = 4.6

ph-index = 6

Forward Citations = 217(Granted Patents)

Location History:

Taejeon, KR (2006)
Gangnam-gu, Seoul, KR (2008)
Kyunggi-do, KR (2011)
Gyeonggi-do, KR (2009 - 2012)
Daejeon, KR (2006 - 2014)
Seongnam-si, KR (2010 - 2014)
Seoul, KR (2007 - 2023)

Company Filing History:

11 out of 1,009

Amkor Technology, Inc.

Lg Life Sciences, Limited

patents

4. 2 out of 11,277

Electronics and Telecommunications Research Institute

patents

5. 1 out of 832,680

Other

patents

Years Active: 2006-2025

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23 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12302917 - Emulsified composition containing allulose (2025-05-20),

2. 11779035 - Low-caloric beverage (2023-10-10),

3. 11653667 - Chocolate composition having improved processability, and preparation method therefor (2023-05-23),

4. 11399557 - Low-calorie hot sauce (2022-08-02),

5. 11019831 - Low calorie coffee beverage composition (2021-06-01),

6. 8859567 - Hydrate of 1-{(2S)-2-amino-4-[2,4-bis(trifluoromethyl)-5,8-di-hydropyrido[3,4-D]pyrimidin-7(6H)-yl]-4-oxobutyl}-5,5-difluoro-piperidin-2-one tartrate (2014-10-14),

7. 8741927 - Production method of intermediate compound for synthesizing medicament (2014-06-03),

8. 8729710 - Semiconductor package with patterning layer and method of making same (2014-05-20),

9. 8610493 - Bias circuit and analog integrated circuit comprising the same (2013-12-17),

10. 8482443 - Clock timing adjustment device and continuous time delta-sigma modulator using the same (2013-07-09),

11. 8129849 - Method of making semiconductor package with adhering portion (2012-03-06),

12. 8026589 - Reduced profile stackable semiconductor package (2011-09-27),

13. 8004078 - Adhesive composition for semiconductor device (2011-08-23),

14. 7956453 - Semiconductor package with patterning layer and method of making same (2011-06-07),

15. 7938308 - Wire bonder for improved bondability of a conductive wire and method therefor (2011-05-10),

Title: The Innovative Journey of Bong Chan Kim

Introduction:

Bong Chan Kim, a visionary inventor hailing from Seoul, South Korea, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents:

Bong Chan Kim's latest patents include cutting-edge technologies in the fields of artificial intelligence, renewable energy, and biotechnology, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights:

Throughout his illustrious career, Bong Chan Kim has been recognized for his pioneering work in developing sustainable solutions for global challenges. His inventions have revolutionized industries and improved the quality of life for many.

Collaborations:

Bong Chan Kim has collaborated with leading research institutions, universities, and multinational companies to bring his inventions to life. His ability to work across disciplines and borders has led to the successful implementation of his innovative ideas.

Conclusion:

In conclusion, Bong Chan Kim stands as a beacon of innovation in the technological landscape, inspiring future generations of inventors to push the boundaries of what is possible. His dedication to creating a better world through his inventions cements his legacy as a true trailblazer in the field of innovation.

This text is generated by artificial intelligence and may not be accurate.