The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2014
Filed:
Apr. 26, 2011
DO Hyeong Kim, Gunpo-si, KR;
Bong Chan Kim, Seongnam-si, KR;
Yoon Joo Kim, Nowon-gu, KR;
Ji Young Chung, Gunpo-si, KR;
Do Hyeong Kim, Gunpo-si, KR;
Bong Chan Kim, Seongnam-si, KR;
Yoon Joo Kim, Nowon-gu, KR;
Ji Young Chung, Gunpo-si, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including one or more semiconductor dies which are electrically connected to an underlying substrate through the use of a conductive pattern which is at least partially embedded in a patterning layer of the package. In a basic embodiment of the present invention, the semiconductor package comprises a substrate having a conductive pattern disposed thereon. Electrically connected to the conductive pattern of the substrate is at least one semiconductor die. The semiconductor die and the substrate are at least partially encapsulated by a patterning layer. Embedded in the patterning layer is a wiring pattern which electrically connects the semiconductor die to the conductive pattern. A portion of the wiring pattern is exposed in the patterning layer.