Amkor Technology, Inc.

Samyang Corporation

Lg Life Sciences, Limited

Electronics and Telecommunications Research Institute

Other

Lg Chem, Ltd

Bong Chan Kim

Yoon Joo Kim

Ji Young Chung

Jae Kyu Song

Seung Mi Lee

Tae-Chul Han

Do Hyung Kim

Youn Sang Kim

Ji Hye Lee

Sang Hoon Kim

Su Youn Lim

Jong-Kee Kwon

Min-Hyung Cho

Kyu Young Kim

Ho Jun Kim

Min Woo Lee

Gyo Hyun Hwang

Hye Jin Lim

Yi-Gyeong Kim

In Tae Kim

Sung Chul Ha

Do Hyeong Kim

Sung Min Lee

Jung Park

Min Kyun Yoo

Sun Hwa Lee

Koo Lee

Eun Sook Sohn

Sang Dae Lee

Yong-In Kim

Il Seo

Suk Kyoon Yoon

Ki Sook Park

Kyung-Hun Ryu

Chan Ha Hwang

Hee Dong Park

Tae Hun Kim

Won Joon Kang

Kyu Woong Lee

Won Hyuk Jung

Cheol Won Park

Joon Su Kim

Hee Bong Lee

Jung Sook Han

Choong Woo Nam

Jae Chul Lee

Se Ra Hong

Sung Ji Kim

Kyung Soon Park

Ji Eun An

Si Young Kim

Mun Gil Ho

Yong Suk Yang

Jung Min Yun

Bo Seung Choi

Kyung Ha Chung

Jae Young Na

Kwan Hyung Cho

Aeri Kim

A-ra Jo

Han Joo Maeng

Yong In Kim

Ae Ri Park

The present disclosure relates to an emulsified food composition which includes a saccharide and an oil, and achieves good flavor expression and saccharide reduction, and a method for preparing same.

Emulsified composition containing allulose

The present invention relates to a low-calorie beverage having excellent sensory properties and sweetness, and more particularly, to a beverage containing allulose as a sweetener.

Low-caloric beverage

The present invention relates to chocolate containing allulose and a method of preparing thereof, and more specifically, provides a chocolate composition having reduction of saccharides added to chocolate, masking of bitter taste of chocolate and excellent emulsion stability, and a method of preparing thereof.

Chocolate composition having improved processability, and preparation method therefor

The present invention relates to low-calorie hot sauces, and more particularly, to hot sauces containing hot spices, acid-resistant thickeners and low-calorie or calorie-free saccharides.

Low-calorie hot sauce

The present invention relates to a coffee drink composition comprising allulose, oligosaccharide and coffee extract, and a method of preparation thereof, and it provides a coffee drink composition having a high sugar content and a low calorie and can give more excellent sensory properties to coffee drinks such as Americano.

Low calorie coffee beverage composition

The present invention relates to 1.5 hydrate of of 1-{(2S)-2-amino-4-[2,4-bis(trifluoromethyl)-5,8-dihydropyrido[3,4-d]pyrimidin-7(6H)-yl]-4-oxobutyl}-5,5-difluoropiperidin-2-one tartrate, a process for preparing the same, and a pharmaceutical composition for inhibiting DPP-IV, which comprises said compound as the active component.

Hydrate of 1-{(2S)-2-amino-4-[2,4-bis(trifluoromethyl)-5,8-di-hydropyrido[3,4-D]pyrimidin-7(6H)-yl]-4-oxobutyl}-5,5-difluoro-piperidin-2-one tartrate

The present invention relates to a novel method for preparing a compound of formula (2) as the intermediate, which can be effectively used for preparation of a compound of formula (1) exhibiting good inhibitory activity against dipeptidyl peptidase IV enzyme.

Production method of intermediate compound for synthesizing medicament

In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including one or more semiconductor dies which are electrically connected to an underlying substrate through the use of a conductive pattern which is at least partially embedded in a patterning layer of the package. In a basic embodiment of the present invention, the semiconductor package comprises a substrate having a conductive pattern disposed thereon. Electrically connected to the conductive pattern of the substrate is at least one semiconductor die. The semiconductor die and the substrate are at least partially encapsulated by a patterning layer. Embedded in the patterning layer is a wiring pattern which electrically connects the semiconductor die to the conductive pattern. A portion of the wiring pattern is exposed in the patterning layer.

Semiconductor package with patterning layer and method of making same

Disclosed is a bias circuit which includes a bias voltage generating part configured to generate a bias voltage using a reference current and a variable current; a reference current source part configured to provide the reference current to the bias voltage generating part; and a current adjusting part configured to provide the variable current to the bias voltage generating part and to adjust the amount of the variable current according to voltage levels of at least two input signals. The bias circuit prevents an increase in power consumption and improves a slew rate at the same time.

Bias circuit and analog integrated circuit comprising the same

Provided is a clock timing adjustment device for adjusting a time difference of clocks and a delta-sigma modulator. The clock timing adjustment device includes a power detection unit and a timing adjustment unit. The power detection unit receives input signals which are generated using pairs of first and second clocks having a plurality of clock time differences and respectively correspond to the clock time differences, detects powers of the input signals, and outputs a control signal corresponding to a clock time difference where the power is minimized. The timing adjustment unit receives a reference clock and the control signal and outputs the first and second clocks having the clock time difference where the power is minimized from the reference clock according to the control signal.

Clock timing adjustment device and continuous time delta-sigma modulator using the same

Disclosed are a semiconductor package and a method of making the same. In the semiconductor package, a substrate and a semiconductor die are covered with and encapsulated by vertically pressing thermosetting resin having fluidity in a predetermined temperature range and denaturalizing itself in gel. Thus, it is possible to reduce a thickness of the semiconductor package and prevent wire sweeping.

Method of making semiconductor package with adhering portion

In accordance with the present invention, there is provided multiple embodiments of a reduced profile stackable semiconductor package. The semiconductor package comprises a substrate having at least one semiconductor die attached thereto. The semiconductor die is also electrically connected to the substrate by a plurality of conductive wires. A package body defining opposed top and bottom surfaces and a side surface at least partially encapsulates the substrate, the conductive wires and the semiconductor die. The package body is formed such that at least portions of the conductive wires are exposed in the top surface thereof. The package body may include a groove formed in the top surface thereof, with at least portions of the conductive wires being exposed in the groove. In this instance, conductive material layers may be disposed within the groove and electrically connected to the exposed portions of respective ones of the conductive wires, with solder pads further bring electrically connected to respective ones of the conductive material layers and at least partially residing within the groove.

Reduced profile stackable semiconductor package

Provided is an adhesive composition for a semiconductor device. For example, the adhesive composition comprises a binder resin and a silicon carbide filler. The silicon carbide filler has relatively high thermal conductivity and a relatively low coefficient of thermal expansion (CTE). Accordingly, the adhesive composition containing the silicon carbide filler exhibits improved heat dissipation performance and electrical performance due to high thermal conductivity and shows inhibition of delamination or cracking of semiconductor devices due to low CTE. The silicon carbide has high thermal conductivity, but is electrically non-conductive. Therefore, an electrically conductive adhesive can be obtained by additional incorporation of a silver (Ag) filler into the binder resin.

Adhesive composition for semiconductor device

A wire bonder has a capillary through which a wire passes. A discharge tip is positioned near a bottom section of the capillary and provides a flame to a distal end of the wire. A gas diffuser is positioned beside the capillary to diffuse a heated gas to the distal end of the wire.

Wire bonder for improved bondability of a conductive wire and method therefor

Growing community of inventors

Seoul, South Korea

Bong Chan Kim