The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2012
Filed:
Oct. 28, 2009
Applicants:
Youn Sang Kim, Gyeonggi-do, KR;
Bong Chan Kim, Gyeonggi-do, KR;
Yoon Joo Kim, Seoul, KR;
Inventors:
Assignee:
Amkor Technology, Inc., Chandler, AZ (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed are a semiconductor package and a method of making the same. In the semiconductor package, a substrate and a semiconductor die are covered with and encapsulated by vertically pressing thermosetting resin having fluidity in a predetermined temperature range and denaturalizing itself in gel. Thus, it is possible to reduce a thickness of the semiconductor package and prevent wire sweeping.