The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2018
Filed:
Dec. 30, 2015
Amkor Technology, Inc., Tempe, AZ (US);
Tae Kyung Hwang, Seoul, KR;
Eun Sook Sohn, Seoul, KR;
Won Joon Kang, Seoul, KR;
Gi Jeong Kim, Gyeonggi-do, KR;
Amkor Technology, Inc., Tempe, AZ (US);
Abstract
An electronic package includes a lead frame structure having one or more structural features configured to improve board level reliability. In one embodiment, the structural feature comprises lead frame protrusions extending outward from the electronic package, which are configured to laterally engage solder structures used to attach the electronic package to a next level of assembly. In another embodiment, conductive bumps are attached to exposed portions of the lead frame in advance of next level assembly processes. In a further embodiment, the lead frame comprises laterally separated contact points for attaching an electron die and for attaching the electronic package to a next level of assembly.