Average Co-Inventor Count = 3.1

ph-index = 9

Forward Citations = 360(Granted Patents)

Location History:

Miyagi, JP (2006 - 2009)
Sendai, JP (2013)
Tokyo, JP (2009 - 2014)
Machida, JP (2013 - 2014)
Hino, JP (2016)
Nagano, JP (2005 - 2018)
Matsumoto, JP (2010 - 2019)
Kanagawa, JP (2002 - 2022)
Kawasaki, JP (2023)

Company Filing History:

26 out of 4,800

Fuji Electric Co., Ltd.

Fuji Electric Device Technology Co., Ltd.

patents

4. 2 out of 116

Fuji Electric Systems Co. Ltd.

patents

5. 2 out of 4,119

Wisconsin Alumni Research Foundation

patents

6. 1 out of 1,438

Stanley Electric Co., Ltd

patents

where one patent can have more than one assignee

Years Active: 2002-2025

where 'Filed Patents' based on already Granted Patents

49 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 12451454 - Manufacturing method of packaging structure for bipolar transistor with constricted bumps (2025-10-21),

2. 11705419 - Packaging structure for bipolar transistor with constricted bumps (2023-07-18),

3. 11545409 - Semiconductor module having block electrode bonded to collector electrode and manufacturing method thereof (2023-01-03),

4. 11531075 - Method and apparatus for integrating current sensors in a power semiconductor module (2022-12-20),

5. 11085977 - Method and apparatus for integrating current sensors in a power semiconductor module (2021-08-10),

6. 10355089 - Semiconductor device and semiconductor device manufacturing method (2019-07-16),

7. 10297527 - Semiconductor device (2019-05-21),

8. 10128166 - Power semiconductor module (2018-11-13),

9. 10090223 - Semiconductor device and method of manufacturing same (2018-10-02),

10. 10090222 - Semiconductor device with heat dissipation and method of making same (2018-10-02),

11. 9999146 - Semiconductor module (2018-06-12),

12. 9824950 - Semiconductor device (2017-11-21),

13. 9786587 - Semiconductor device and method for manufacturing the semiconductor device (2017-10-10),

14. 9579746 - Thermocompression bonding structure and thermocompression bonding method (2017-02-28),

15. 9504154 - Semiconductor device (2016-11-22),

Title: The Innovative Journey of Eiji Mochizuki

Introduction:

Eiji Mochizuki, a pioneering inventor hailing from Matsumoto, Japan, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents:

Eiji Mochizuki's latest patents include advancements in artificial intelligence algorithms for autonomous vehicles, wearable health monitoring devices, and sustainable energy solutions.

Career Highlights:

With a career spanning over two decades, Eiji Mochizuki has been at the forefront of technological advancements. He has been awarded numerous accolades for his innovative work in the fields of robotics, biotechnology, and renewable energy.

Collaborations:

Eiji Mochizuki has collaborated with leading research institutions, universities, and tech companies worldwide to further his inventions. His collaborative efforts have resulted in cutting-edge technologies that have revolutionized various industries.

Conclusion:

In conclusion, Eiji Mochizuki's relentless pursuit of innovation and his passion for creating solutions to complex challenges have solidified his position as a visionary inventor in the global tech landscape. His contributions continue to inspire future generations of inventors and innovators.

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