The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

May. 28, 2014
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, JP;

Inventors:

Shinji Tada, Hino, JP;

Eiji Mochizuki, Hino, JP;

Hideyo Nakamura, Hino, JP;

Masafumi Horio, Hino, JP;

Assignee:

Fuji Electric Co., Ltd., Kawasaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/11 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 1/117 (2013.01); H01L 24/01 (2013.01); H05K 1/0263 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H05K 1/181 (2013.01); H05K 3/328 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10272 (2013.01); H05K 2201/10303 (2013.01);
Abstract

A semiconductor device composed of a plurality of semiconductor modules exhibiting a large current carrying capacity for a semiconductor device as a whole is disclosed. The connection between the plurality of semiconductor modules is conducted by means of optimum construction suited to the semiconductor device. The device comprises a semiconductor module having externally connecting terminals protruding out of a casing, bus bars electrically connecting the specific externally connecting terminals of the plurality of semiconductor modules arranged in parallel with each other, and a semiconductor module case covering and fastening the plurality of semiconductor modules connected with the bus bars. The bus bars and the externally connecting terminals of the semiconductor modules are joined by means of laser welding.


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