The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Oct. 27, 2016
Applicant:
Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;
Inventors:
Motohito Hori, Matsumoto, JP;
Yoshinari Ikeda, Matsumoto, JP;
Hideyo Nakamura, Matsumoto, JP;
Eiji Mochizuki, Matsumoto, JP;
Tatsuo Nishizawa, Matsumoto, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki-Shi, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 5/02 (2006.01); H01L 23/50 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 25/11 (2006.01); H01L 25/18 (2006.01); H05K 5/00 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0256 (2013.01); H01L 23/50 (2013.01); H01L 23/5385 (2013.01); H01L 23/5389 (2013.01); H01L 25/0655 (2013.01); H01L 25/115 (2013.01); H01L 25/18 (2013.01); H05K 5/0021 (2013.01); H05K 5/0204 (2013.01); H05K 5/0247 (2013.01); H05K 7/1432 (2013.01);
Abstract
A semiconductor module includes sealing resin from which a main terminal protrudes, which seals an insulating substrate. The module includes a semiconductor element and a wiring substrate. The sealing resin has a nut housing portion in which a nut is disposed. The semiconductor module also has a busbar terminal to which a main terminal that protrudes from the sealing resin is electrically connected and which has an insertion hole facing the nut.