Drew W. Delaney, an accomplished inventor based in Chandler, Arizona, holds an impressive total of 14 patents. His work primarily focuses on advancements in microelectronics, specifically within the realm of packaging techniques that improve device performance. Delaney’s innovative designs contribute to the ongoing evolution of technology, showcasing his expertise in the field.

Latest Patents

Among his latest innovations, Delaney has developed a method for forming an interference shield on a substrate. This apparatus includes a die featuring a device side with contact points and lateral sidewalls, which define the thickness of the die. A build-up carrier is coupled to the die, consisting of alternating layers of patterned conductive material and insulating material. Notably, at least one layer of patterned conductive material connects to one of the contact points of the die. The interference shield, made of conductive material, is disposed on the die and a portion of the build-up carrier, allowing for connections to a printed circuit board.

Another recent patent focuses on bumpless build-up layer package warpage reduction. This innovation is relevant in the fabrication of microelectronic packages, specifically the formation of a bumpless build-up layer coreless (BBUL-C) microelectronic package. It incorporates a warpage control structure on the back surface of the microelectronic device, featuring a layered design that includes both high coefficient of thermal expansion materials and high elastic modulus material layers.

Career Highlights

Drew W. Delaney’s career is marked by his significant contributions to Intel Corporation, a global leader in semiconductor manufacturing. His dedication to advancing microelectronic technologies has established him as a prominent figure within the company and the industry. Delaney's innovations not only enhance performance but also push the boundaries of what is possible in microelectronics.

Collaborations

During his career, Delaney has worked alongside other notable inventors, including Ravi Kiran Nalla and John Stephen Guzek. This collaborative spirit fosters an environment of creativity and innovation, further propelling advancements in microelectronics and packaging techniques.

Conclusion

Drew W. Delaney exemplifies the essence of innovation in the field of microelectronics. With his dedicated work at Intel Corporation and a growing portfolio of patents, Delaney continues to make significant strides in enhancing device efficiency and performance. His contributions not only reflect his individual talent but also serve as a testament to the importance of collaboration in driving technological advancements.

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