The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2016
Filed:
Jun. 16, 2014
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
John S. Guzek, Chandler, AZ (US);
Ravi K. Nalla, San Jose, CA (US);
Javier Solo Gonzalez, Chandler, AZ (US);
Drew Delaney, Chandler, AZ (US);
Suresh Pothukuchi, Chandler, AZ (US);
Mohit Mamodia, Chandler, AZ (US);
Edward Zarbock, Gilbert, AZ (US);
Johanna M. Swan, Scottsdale, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/498 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 25/03 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 23/5389 (2013.01); H01L 24/24 (2013.01); H01L 24/73 (2013.01); H01L 24/82 (2013.01); H01L 25/03 (2013.01); H01L 25/0657 (2013.01); H01L 23/49816 (2013.01); H01L 24/48 (2013.01); H01L 25/18 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73259 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01057 (2013.01);
Abstract
An apparatus includes a coreless substrate with a through-silicon via (TSV) embedded die that is integral to the coreless substrate. The apparatus includes a subsequent die that is coupled to the TSV die and that is disposed above the coreless substrate.