The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2006
Filed:
Dec. 01, 2003
Applicants:
Mahesh Sambasivam, Pennington, NJ (US);
Drew W. Delaney, Gilbert, AZ (US);
Saeed Shojaie, Gilbert, AZ (US);
Inventors:
Mahesh Sambasivam, Pennington, NJ (US);
Drew W. Delaney, Gilbert, AZ (US);
Saeed Shojaie, Gilbert, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
Methods of forming microelectronic devices by disposing a radiation curable underfill material or adhesive material between a substrate and a microelectronic die, and exposing any radiation curable material which bleeds-out therefrom to radiation before or immediately after disposition, thereby reducing the extent of material bleed-out.