The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2014
Filed:
Jan. 08, 2013
Ravi K. Nalla, San Jose, CA (US);
Mathew J. Manusharow, Phoenix, AZ (US);
Drew W. Delaney, Chandler, AZ (US);
Ravi K. Nalla, San Jose, CA (US);
Mathew J. Manusharow, Phoenix, AZ (US);
Drew W. Delaney, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A microelectronic package includes a substrate (), a die () embedded within the substrate, the die having a front side () and a back side () and a through-silicon-via () therein, build-up layers () built up over the front side of the die, and a power plane () in physical contact with the back side of the die. In another embodiment, the microelectronic package comprises a substrate (), a first die () and a second die () embedded in the substrate and having a front side () and a back side () and a through-silicon-via () therein, build-up layers () over the front sides of the first and second dies, and an electrically conductive structure () in physical contact with the back sides of the first and second dies.