Hsinchu, Taiwan

Ding-Ming Kwai

This inventor holds 21 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging. Top assignees: Industrial Technology Research Institute, National Tsing Hua University. Active years: 2011-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ding-Ming Kwai. Retrieved from https://idiyas.com/inventor/ding-ming-kwai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 21 

% Patents Active = 100.0

Average Co-Inventor Count = 2.7

ph-index = 3

Forward Citations = 49(Granted Patents)


Location History:

  • Hualien County, TW (2011)
  • Hsinchu, TW (2012)
  • Hsinchu County, TW (2011 - 2019)
  • Zhubei, TW (2014 - 2020)

Company Filing History:


Years Active: 2011-2020

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Areas of Expertise:
Power Distribution Network
Memory Control
3D Chip Stacking
Fault-Tolerance
Integrated Circuit Repair
Wafer Yield Rate
Through-Silicon-Via
Hardwired Switch
Die Stacking Structure
Bump Re-Assignment
Self-Test Circuit
Yield Prejudgment
21 patents (USPTO):Explore Patents

Title: Spotlight on Ding-Ming Kwai: Innovator and Patent Holder

Introduction: Ding-Ming Kwai, based in Hsinchu County, Taiwan, is a prominent innovator known for his significant contributions to technology and engineering. With an impressive portfolio of 21 patents, Kwai has made a notable impact in the field of power management and semiconductor technology.

Latest Patents: Among his latest innovations, Kwai has developed a "Power Source Tolerance Analysis Method and System." This groundbreaking method involves analyzing voltage drops across multiple power sources in a power delivery network (PDN). By determining the respective supply currents and sorting them, the method effectively identifies a selection of target power sources based on a defined target number. Another noteworthy patent is the "Method of Yield Prejudgment and Bump Re-Assignment and Computer Readable Storage Medium." This invention addresses the challenges in die manufacturing by predicting successful connections of different areas linked to substrates and reorganizing bump placements for enhanced reliability and performance.

Career Highlights: Kwai has made significant strides throughout his career, contributing to reputable organizations such as the Industrial Technology Research Institute and National Tsing Hua University. His work at these institutions has both advanced research and fostered innovative solutions in technology.

Collaborations: Throughout his career, Ding-Ming Kwai has collaborated with talented individuals, including esteemed coworkers Yung-Fa Chou and Chang-Tzu Lin. These collaborations have enriched his research and contributed to the successful development of his innovative patents.

Conclusion: Ding-Ming Kwai exemplifies the essence of innovation through his impressive patent portfolio and contributions to the tech industry. His ongoing commitment to advancing technology continues to inspire future generations of inventors and researchers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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