The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2019
Filed:
Dec. 04, 2017
Industrial Technology Research Institute, Hsinchu, TW;
Chi-Han Lee, Kaohsiung, TW;
Ding-Ming Kwai, Hsinchu County, TW;
Chang-Tzu Lin, Hsinchu County, TW;
I-Hsuan Lee, Hsinchu, TW;
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu, TW;
Abstract
A method of yield prejudgment and bump re-assignment for a die is provided. The die includes a plurality of areas. Each area is electrically connected to a substrate through a corresponding bump. The successful-connection probability of each area is prejudged. The die is divided into a signal region and a short-circuit region according to the successful-connection probabilities. The positions of the bumps are arranged so that signal bumps are disposed in the signal region and power bumps are disposed in the short region.