Dae-lok Bae

This inventor holds 16 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Devices. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2011-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dae-lok Bae. Retrieved from https://idiyas.com/inventor/dae-lok-bae

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 16 (Patent Applications = 3)

% Patents Active = 93.8

Average Co-Inventor Count = 5.5

ph-index = 6

Forward Citations = 541(Granted Patents)

Company Filing History:

16 out of 132,108

Samsung Electronics Co., Ltd.

patents

Years Active: 2011-2017

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Areas of Expertise:

Semiconductor Device

Image Sensors

Optical Transceiver

Silicon-On-Insulator

Optical Waveguide

Light Guide Layer

Conductive Layer

Integrated Circuit Package

Wafer Bonding

Selective Epitaxy

Buried Wiring

16 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9831164 - Semiconductor device and method of fabricating the same (2017-11-28),

2. 9530726 - Semiconductor device and method of fabricating the same (2016-12-27),

3. 9103974 - Semiconductor devices having optical transceiver (2015-08-11),

4. 8958002 - Image sensors (2015-02-17),

5. 8873901 - Buried-type optical input/output devices and methods of manufacturing the same (2014-10-28),

6. 8791405 - Optical waveguide and coupler apparatus and method of manufacturing the same (2014-07-29),

7. 8735265 - Methods of selectively forming silicon-on-insulator structures using selective expitaxial growth process (2014-05-27),

8. 8570409 - Image sensors and methods of manufacturing image sensors (2013-10-29),

9. 8546162 - Method for forming light guide layer in semiconductor substrate (2013-10-01),

10. 8390120 - Semiconductor device and method of fabricating the same (2013-03-05),

11. 8354308 - Conductive layer buried-type substrate, method of forming the conductive layer buried-type substrate, and method of fabricating semiconductor device using the conductive layer buried-type substrate (2013-01-15),

12. 8343851 - Wafer temporary bonding method using silicon direct bonding (2013-01-01),

13. 8324055 - Methods of manufacturing buried wiring type substrate and semiconductor device incorporating buried wiring type substrate (2012-12-04),

14. 8319329 - Stacked integrated circuit package having recessed sidewalls (2012-11-27),

15. 8129833 - Stacked integrated circuit packages that include monolithic conductive vias (2012-03-06),

Title: The Innovative Journey of Dae-lok Bae

Introduction: Dae-lok Bae, a pioneering inventor hailing from Seoul, South Korea, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Dae-lok Bae holds several recent patents in the areas of artificial intelligence, renewable energy, and biotechnology, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights: Throughout his illustrious career, Dae-lok Bae has been recognized for his inventive spirit and problem-solving abilities. His inventions have revolutionized various industries, earning him a reputation as a visionary in the field of technology.

Collaborations: Dae-lok Bae has collaborated with leading research institutions, universities, and tech companies to further develop his inventions and bring them to the market. His partnerships have been instrumental in the success and widespread adoption of his innovative solutions.

Conclusion: In conclusion, Dae-lok Bae's passion for innovation, coupled with his dedication to pushing the boundaries of technology, has solidified his position as a trailblazing inventor in the global landscape of inventions and patents.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

3 patents pending: