The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2013
Filed:
Sep. 17, 2009
Jung-ho Kim, Suwon-si, KR;
Dae-lok Bae, Seoul, KR;
Jong-wook Lee, Yongin-si, KR;
Seung-woo Choi, Seoul, KR;
Pil-kyu Kang, Anyang-si, KR;
Jung-ho Kim, Suwon-si, KR;
Dae-lok Bae, Seoul, KR;
Jong-wook Lee, Yongin-si, KR;
Seung-woo Choi, Seoul, KR;
Pil-kyu Kang, Anyang-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
A wafer temporary bonding method using silicon direct bonding (SDB) may include preparing a carrier wafer and a device wafer, adjusting roughness of a surface of the carrier wafer, and combining the carrier wafer and the device wafer using the SDB. Because the method uses SDB, instead of an adhesive layer, for a temporary bonding process, a module or process to generate and remove an adhesive is unnecessary. Also, a defect in a subsequent process, for example, a back-grinding process, due to irregularity of the adhesive may be prevented.