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For the Inventor, By the Inventor

Mohegan Lake, NY, United States of America

Cornelia Kang-I Tsang

This inventor holds 24 USPTO granted patents and 4 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging. Top assignees: International Business Machines Corporation, Globalfoundries Inc., Ultratech, Inc.. Active years: 2006-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cornelia Kang-I Tsang. Retrieved from https://idiyas.com/inventor/cornelia-kang-i-tsang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 79.2

 

Average Co-Inventor Count = 4.4

ph-index = 8

Forward Citations = 163(Granted Patents)


Location History:

  • Yorktown Heights, NY (US) (2011)
  • Mohegan, NY (US) (2014)
  • Mohegan Lake, NY (US) (2006 - 2019)
  • Medford, CT (US) (2022)

Company Filing History:

goldMedal20 out of 166,351 
 
International Business Machines Corporation
 patents
silverMedal2 out of 5,671 
 
Globalfoundries Inc.
 patents
bronzeMedal2 out of 138 
 
Ultratech, Inc.
 patents

Years Active: 2006-2022

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Areas of Expertise:
Handler Bonding
Debonding Processes
Wafer Debonding
Infrared Radiation Ablation
Phased Array Antennas
Test Probe Substrate
Silicon Chicklet Pedestal
Through Silicon Via
Integrated Circuit Chips
mmWave Applications
Deep Filled Vias
Passive Components
24 patents (USPTO):Explore Patents
1. 11424152 - Handler bonding and debonding for semiconductor dies (2022-08-23),
2. 10381255 - Double layer release temporary bond and debond processes and systems (2019-08-13),
3. 10297479 - Wafer debonding using mid-wavelength infrared radiation ablation (2019-05-21),
4. 10224229 - Double layer release temporary bond and debond processes and systems (2019-03-05),
5. 10103450 - Integration of area efficient antennas for phased array or wafer scale array antenna applications (2018-10-16),
6. 9897627 - Test probe substrate (2018-02-20),
7. 9851379 - Test probe substrate (2017-12-26),
8. 9636782 - Wafer debonding using mid-wavelength infrared radiation ablation (2017-05-02),
9. 9606142 - Test probe substrate (2017-03-28),
10. 9586291 - Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release (2017-03-07),
11. 9472859 - Integration of area efficient antennas for phased array or wafer scale array antenna applications (2016-10-18),
12. 9269561 - Wafer debonding using long-wavelength infrared radiation ablation (2016-02-23),
13. 8806740 - Silicon chicklet pedestal (2014-08-19),
14. 8735251 - Through silicon via and method of fabricating same (2014-05-27),
15. 8637937 - Through silicon via for use in integrated circuit chips (2014-01-28),

Title: Cornelia Kang-I Tsang: Innovator in Semiconductor Technology

Introduction

Cornelia Kang-I Tsang, based in Mohegan Lake, NY, is a distinguished inventor with a remarkable portfolio of 24 patents. His contributions primarily focus on advancements in semiconductor technology, illustrating his deep understanding of the industry and innovation capabilities.

Latest Patents

Among his latest patented inventions are innovative processes for handling bonding and debonding semiconductor dies. One notable embodiment involves applying a release layer to a handler, incorporating additives that modify the absorption properties of electro-magnetic radiation. This invention innovatively utilizes a 355 nm chemical absorber along with other absorbers for wavelengths between 600 nm to 740 nm. His patented method allows for efficient bonding and subsequently debonding of semiconductor devices using precise laser irradiation to ablate the release layer, ensuring safe removal from the transparent handler.

Another significant patent focuses on a double-layer release temporary bond and debond process. This invention details a bonded structure with a substrate and multiple layers, including a first release layer designed to absorb specific wavelengths of light for effective decomposition. Furthermore, it introduces a debonding method that allows for the recycling of adhesive layers, showcasing a commitment to sustainability in semiconductor manufacturing.

Career Highlights

Cornelia’s career includes valuable experience at prominent companies such as IBM and GlobalFoundries Inc. His work at these institutions has significantly contributed to the development and refinement of semiconductor technologies, further solidifying his status as a leader in the field.

Collaborations

Throughout his career, Cornelia has collaborated with fellow innovators, including John Ulrich Knickerbocker and Bing Dang. These collaborations have fostered an environment of shared knowledge and expertise, driving forward groundbreaking advancements in semiconductor processes and applications.

Conclusion

Cornelia Kang-I Tsang is an influential figure in the semiconductor industry, with a robust portfolio of patents that pave the way for future innovations. His work not only reflects his technical prowess but also illustrates a dedication to advancing technology for better efficiency and sustainability in semiconductor manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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