The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2019
Filed:
Jan. 11, 2017
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Bing Dang, Chappaqua, NY (US);
John U. Knickerbocker, Yorktown Heights, NY (US);
Cornelia Kang-I Tsang, Mohegan Lake, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/57 (2014.01); H01L 21/683 (2006.01); B32B 43/00 (2006.01); H01L 21/67 (2006.01); B23K 26/36 (2014.01);
U.S. Cl.
CPC ...
H01L 21/67132 (2013.01); B23K 26/36 (2013.01); B23K 26/57 (2015.10); H01L 21/67092 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 21/6838 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); Y10S 156/93 (2013.01); Y10S 156/941 (2013.01); Y10T 156/1158 (2015.01); Y10T 156/1917 (2015.01);
Abstract
Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiation.