The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
Jan. 22, 2013
Applicant:
Globalfoundries Inc., Grand Cayman, KY;
Inventors:
Bing Dang, Chappaqua, NY (US);
John U. Knickerbocker, Monroe, NY (US);
Cornelia Kang-I Tsang, Mohegan Lake, NY (US);
Assignee:
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 21/683 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
H01L 21/02002 (2013.01); H01L 21/67092 (2013.01); H01L 21/6835 (2013.01); B82Y 30/00 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); Y10S 977/902 (2013.01); Y10T 156/1158 (2015.01); Y10T 156/1917 (2015.01); Y10T 428/24355 (2015.01); Y10T 428/265 (2015.01); Y10T 428/31678 (2015.04);
Abstract
Methods are provided for handling a device wafer. For example, a method includes providing a stack structure having a device wafer, a handler wafer, and a bonding structure disposed between the device wafer and handler wafer, and irradiating the bonding structure with long-wavelength infrared energy to ablate the bonding structure.