The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Mar. 27, 2014
Applicant:
Globalfoundries Inc., Grand Cayman, KY;
Inventors:
Bing Dang, Chappaqua, NY (US);
John U. Knickerbocker, Yorktown Heights, NY (US);
Eric Peter Lewandowski, White Plains, NY (US);
Cornelia Kang-I Tsang, Mohegan Lake, NY (US);
Assignee:
GLOBALFOUNDRIES INC, Grand Cayman, KY;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); B23K 26/36 (2014.01); G01R 31/26 (2014.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
B23K 26/36 (2013.01); G01R 31/2607 (2013.01); H01L 21/302 (2013.01); H01L 21/6835 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); Y10T 156/1158 (2015.01); Y10T 156/1917 (2015.01); Y10T 428/265 (2015.01); Y10T 428/30 (2015.01); Y10T 428/31678 (2015.04);
Abstract
Methods are provided to form adhesive materials that are used to temporarily bond handler wafers to device wafers, and which enable mid-wavelength infrared laser ablation release techniques to release handler wafers from device wafers.