Company Filing History:

22 out of 40,780

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

3 out of 117

TSMC Solid State Lighting Ltd.

Years Active: 2003-2019

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27 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10269731 - Apparatus for dicing interposer assembly (2019-04-23),

2. 9362474 - Vertical LED chip package on TSV carrier (2016-06-07),

3. 9343505 - Wafer level reflector for LED packaging (2016-05-17),

4. 9337096 - Apparatus and methods for molding die on wafer interposers (2016-05-10),

5. 9337063 - Package for three dimensional integrated circuit (2016-05-10),

6. 9136211 - Protected solder ball joints in wafer level chip-scale packaging (2015-09-15),

7. 8946893 - Apparatus for dicing interposer assembly (2015-02-03),

8. 8900893 - Vertical LED chip package on TSV carrier (2014-12-02),

9. 8816495 - Structures and formation methods of packages with heat sinks (2014-08-26),

10. 8772929 - Package for three dimensional integrated circuit (2014-07-08),

11. 8642390 - Tape residue-free bump area after wafer back grinding (2014-02-04),

12. 8629043 - Methods for de-bonding carriers (2014-01-14),

13. 8628984 - Light-emitting diode (LED) package systems (2014-01-14),

14. 8580683 - Apparatus and methods for molding die on wafer interposers (2013-11-12),

15. 8501590 - Apparatus and methods for dicing interposer assembly (2013-08-06),

Title: **Innovations and Contributions of Chung Yu Wang**

Introduction

Chung Yu Wang, a prolific inventor based in Hsin-Chu, Taiwan, has made significant strides in the field of semiconductor technology. With 27 patents to his name, he has a proven track record of innovation that showcases his expertise in advancing electronic components and systems.

Latest Patents

Chung Yu Wang's latest contributions include two notable patents. The first is an **Apparatus for Dicing Interposer Assembly**, which provides methods for dicing integrated circuit dies mounted on wafer interposers. This sophisticated apparatus encompasses a wafer carrier sized for silicon interposers, along with a patterned fixture that supports the die side of the interposer and includes adhesive tape for secure attachment.

The second patent is for a **Vertical LED Chip Package on TSV Carrier**, which features a carrier wafer with a through-substrate via (TSV) that enables electrical connections between opposite sides of the wafer. The integrated light-emitting device (LED) is bonded onto the carrier and is designed for optimal thermal management with the use of a conductive thermal interface material.

Career Highlights

Throughout his career, Chung Yu Wang has been associated with leading companies in the semiconductor industry, including Taiwan Semiconductor Manufacturing Company (TSMC) and TSMC Solid State Lighting Ltd. His work in these organizations reflects his commitment to enhancing the capabilities and efficiency of semiconductor products.

Collaborations

Chung has collaborated with notable colleagues in the field, including Jing-Cheng Lin and Kung-Chen Yeh. Together, they have worked on various innovations to push the boundaries of what is achievable in semiconductor technology.

Conclusion

In conclusion, Chung Yu Wang's extensive patent portfolio and his contributions to reputable organizations underscore his role as a leading inventor in semiconductor technology. His inventions not only demonstrate technical ingenuity but also pave the way for future advancements in the industry.

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