The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Dec. 01, 2014
Applicant:
Epistar Corporation, Hsinchu, TW;
Inventor:
Chung Yu Wang, Hsin-Chu, TW;
Assignee:
EPISTAR CORPORATION, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); H01L 33/62 (2010.01); H01L 27/15 (2006.01); H01L 33/06 (2010.01); H01L 33/10 (2010.01); H01L 33/32 (2010.01); H01L 33/58 (2010.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 33/00 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 33/647 (2013.01); H01L 24/32 (2013.01); H01L 24/94 (2013.01); H01L 27/15 (2013.01); H01L 33/0025 (2013.01); H01L 33/06 (2013.01); H01L 33/10 (2013.01); H01L 33/32 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 23/481 (2013.01); H01L 24/29 (2013.01); H01L 24/45 (2013.01); H01L 24/73 (2013.01); H01L 33/0079 (2013.01); H01L 33/54 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/83895 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/94 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01026 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15311 (2013.01); H01L 2933/0066 (2013.01);
Abstract
A light-emitting device (LED) package component includes a carrier wafer. The carrier wafer includes a first through-substrate via (TSV) configured to electrically connecting features on opposite sides of the carrier wafer. A light-emitting device (LED) is bonded onto the carrier wafer. The LED are electrically connected to the first TSV. A conductive thermal interface material (TIM) is located between, and adjoining, the first TSV and the LED.