The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2014
Filed:
Feb. 11, 2010
Applicant:
Chung Yu Wang, Hsin-Chu, TW;
Inventor:
Chung Yu Wang, Hsin-Chu, TW;
Assignee:
TSMC Solid State Lighting Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/72 (2006.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 33/00 (2010.01); H01L 33/54 (2010.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01015 (2013.01); H01L 2224/49107 (2013.01); H01L 2924/01075 (2013.01); H01L 2224/83895 (2013.01); H01L 2224/2919 (2013.01); H01L 2924/01082 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/83815 (2013.01); H01L 24/29 (2013.01); H01L 2224/94 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/12041 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/01013 (2013.01); H01L 2224/45147 (2013.01); H01L 33/0079 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/73265 (2013.01); H01L 2933/0066 (2013.01); H01L 24/45 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/15311 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 33/54 (2013.01); H01L 2924/01033 (2013.01); H01L 24/94 (2013.01); H01L 2924/014 (2013.01); H01L 23/481 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/48227 (2013.01); H01L 24/32 (2013.01); H01L 2924/01029 (2013.01); H01L 2224/291 (2013.01);
Abstract
A method of forming a light-emitting device (LED) package component includes providing a substrate; forming an LED on the substrate; and lifting the LED off the substrate. A carrier wafer is provided, which includes a through-substrate via (TSV) configured to electrically connecting features on opposite sides of the carrier wafer. The LED is bonded onto the carrier wafer, with the LED electrically connected to the TSV.