The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2014
Filed:
Nov. 16, 2011
Chung Yu Wang, Hsin-Chu, TW;
Jui-pin Hung, Hsin-Chu, TW;
Chih-hao Chen, Hsin-Chu, TW;
Chun-hsing Su, New Taipei, TW;
Yi-chao Mao, Zhongli, TW;
Kung-chen Yeh, Taichung, TW;
Yi-lin Tsai, Tainan, TW;
Ying-tz Hung, Guishan Township, TW;
Chin-fu Kao, Taipei, TW;
Shih-yi Syu, Daxi Township, TW;
Chin-chuan Chang, Zhudong Township, TW;
Hsien-wen Liu, Hsin-Chu, TW;
Long Hua Lee, Taipei, TW;
Chung Yu Wang, Hsin-Chu, TW;
Jui-Pin Hung, Hsin-Chu, TW;
Chih-Hao Chen, Hsin-Chu, TW;
Chun-Hsing Su, New Taipei, TW;
Yi-Chao Mao, Zhongli, TW;
Kung-Chen Yeh, Taichung, TW;
Yi-Lin Tsai, Tainan, TW;
Ying-Tz Hung, Guishan Township, TW;
Chin-Fu Kao, Taipei, TW;
Shih-Yi Syu, Daxi Township, TW;
Chin-Chuan Chang, Zhudong Township, TW;
Hsien-Wen Liu, Hsin-Chu, TW;
Long Hua Lee, Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method includes performing a dicing on a composite wafer including a plurality of dies, wherein the composite wafer is bonded on a carrier when the step of dicing is performed. After the step of dicing, the composite wafer is mounted onto a tape. The carrier is then de-bonded from the composite wafer and the first tape.