Jui-Pin Hung

Title: Jui-Pin Hung: Innovating with Integrated Passive Device Packages and More

Introduction:

In the world of innovations and patents, there are remarkable individuals who leave a lasting impact through their groundbreaking work. One such innovator is Jui-Pin Hung, hailing from Hsinchu, Taiwan. With an impressive portfolio of 134 patents to his name, Hung has made substantial contributions to the field of integrated circuit structures. This article will delve into his latest patents, career highlights, collaborations, and the company he works for - Taiwan Semiconductor Manufacturing Comp. Ltd.

Latest Patents:

Jui-Pin Hung's most recent patents showcase his expertise in advancing technologies related to integrated circuit packaging. Notably, one of his latest patents is the "Integrated Passive Device Package and Methods of Forming Same." This package features a first die, a second die, and a molding compound that extends along their sidewalls. The innovative design also incorporates redistribution layers (RDLs) that extend past the edges of the dies. An input/output (I/O) contact, electrically connected to both dies, is exposed at a sidewall of the package. This patent demonstrates Hung's ability to streamline integrated circuit packaging for improved performance and functionality.

Another recent patent of Hung's is the "Integrated Circuit Structure and Method for Reducing Polymer Layer Delamination." This invention tackles an issue commonly encountered in integrated circuits – polymer layer delamination. Hung's method involves the incorporation of a barrier layer on the top surface of the first polymer layer to mitigate delamination risks. This innovation showcases his commitment to enhancing the reliability and durability of integrated circuit structures.

Career Highlights:

Jui-Pin Hung has built an illustrious career through his significant contributions in semiconductor technology. As an employee of Taiwan Semiconductor Manufacturing Comp. Ltd. (also known as TSMC), one of the world's leading semiconductor foundries, Hung has had extensive opportunities to innovate and further his expertise in integrated circuit design and fabrication.

Collaborations:

Innovation often flourishes through teamwork and collaboration. Jui-Pin Hung has had the privilege to collaborate with talented individuals during his career. Notable among his coworkers are Jing-Cheng Lin and Chen-Hua Yu. Together, they have undoubtedly pushed the boundaries of integrated circuit technologies, enabling them to make even more valuable contributions to the field.

Conclusion:

Jui-Pin Hung's remarkable career and vast patent portfolio make him a true trailblazer in the world of integrated circuit structures. His latest inventions, ranging from integrated passive device packages to methods for reducing polymer layer delamination, showcase his dedication to improving semiconductor technologies. As part of Taiwan Semiconductor Manufacturing Comp. Ltd., Hung has the opportunity to continue pushing the boundaries of innovation in this fast-paced industry. With talented collaborators by his side, the future looks bright for Jui-Pin Hung and his ongoing pursuit of advancements in integrated circuit design and fabrication.