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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11205579 B1

PDFFull Text
Date of Patent:
Dec. 21, 2021

Filed:

Jun. 12, 2017

Molding wafer chamber

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Jing-Cheng Lin, Hsinchu, TW;

Chin-Chuan Chang, Zhudong Township, TW;

Jui-Pin Hung, Hsinchu, TW;

Szu-Wei Lu, Hsinchu, TW;

Shin-Puu Jeng, Hsinchu, TW;

Chen-Hua Yu, Hsinchu, TW;

Assignee:

Taiwan Seminconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Ryan M Ochylski

Int. Cl.
CPC ...
B29C 33/12 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/561 (2013.01); B29C 33/123 (2013.01); H01L 21/566 (2013.01); H01L 24/96 (2013.01); H01L 23/3121 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A bottom chase and a top chase of a molding system form a cavity to house a molding carrier and one or more devices. The molding carrier is placed in a desired location defined by a guiding component. The guiding component may be entirely within the cavity, or extend above a surface of the bottom chase and extend over a contacting edge of the top chase and the bottom chase, so that there is a gap between the edge of the top chase and the edge of the molding carrier which are filled by molding materials to cover the edge of the molding carrier. Releasing components may be associated with the top chase and/or the bottom chase, which may be a plurality of tape roller with a releasing film, or a plurality of vacuum holes within the bottom chase, or a plurality of bottom pins with the bottom chase.

Find Patent Forward Citations

Lin, Jing-Cheng. (2021). Molding wafer chamber (U.S. Patent No. 11205579). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11205579

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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