Long Hua Lee

This inventor holds 15 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Chang Chun Plastics Co., Ltd.. Active years: 2005-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Long Hua Lee. Retrieved from https://idiyas.com/inventor/long-hua-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 15

% Patents Active = 93.3

Average Co-Inventor Count = 5.9

ph-index = 4

Forward Citations = 26(Granted Patents)

Company Filing History:

14 out of 42,965

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

1 out of 103

Chang Chun Plastics Co., Ltd.

patents

Years Active: 2005-2024

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Areas of Expertise:

Integrated Fan-Out Packages

Heat Sink

Underfill Structure

Semiconductor Device

Die-to-Die Gap Control

Three Dimensional Integrated Circuit

Optical Waveguide

Acrylate

Titanium Alkoxide

15 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12148661 - Method of forming integrated fan-out packages with built-in heat sink (2024-11-19),

2. 12080617 - Underfill structure for semiconductor packages and methods of forming the same (2024-09-03),

3. 11842936 - Underfill structure for semiconductor packages and methods of forming the same (2023-12-12),

4. 11621205 - Underfill structure for semiconductor packages and methods of forming the same (2023-04-04),

5. 11257715 - Integrated fan-out packages and methods of forming the same (2022-02-22),

6. 11201097 - Method of manufacture of a semiconductor device (2021-12-14),

7. 11121050 - Method of manufacture of a semiconductor device (2021-09-14),

8. 11075133 - Underfill structure for semiconductor packages and methods of forming the same (2021-07-27),

9. 10510595 - Integrated fan-out packages and methods of forming the same (2019-12-17),

10. 10157879 - Die-to-die gap control for semiconductor structure and method (2018-12-18),

11. 9337063 - Package for three dimensional integrated circuit (2016-05-10),

12. 8963334 - Die-to-die gap control for semiconductor structure and method (2015-02-24),

13. 8772929 - Package for three dimensional integrated circuit (2014-07-08),

14. 8629043 - Methods for de-bonding carriers (2014-01-14),

15. 6852358 - Process for preparing an optical waveguide component from acrylate/titanium alkoxide composite material and the prepared optical waveguide component (2005-02-08),

Title: The Innovative Journey of Long Hua Lee

Introduction: Long Hua Lee, a pioneering inventor hailing from Taipei, Taiwan, has made significant contributions to the world of innovations with his groundbreaking ideas and inventions.

Latest Patents: Lee's latest patents showcase his continuous dedication to pushing the boundaries of technology and creativity. His recent inventions focus on improving sustainability in the energy sector and enhancing efficiency in manufacturing processes.

Career Highlights: With a career spanning over two decades, Lee has established himself as a prominent figure in the field of inventions. His journey includes working with leading tech companies, research institutions, and universities to bring his ideas to life.

Collaborations: Throughout his career, Lee has collaborated with top engineers, scientists, and designers to transform his concepts into tangible inventions. His ability to work in multidisciplinary teams has led to the development of cutting-edge technologies that have revolutionized various industries.

Conclusion: Long Hua Lee's passion for innovation, coupled with his relentless drive to create, has solidified his position as a trailblazing inventor. His remarkable journey continues to inspire aspiring inventors and shape the future of technological advancements.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]