Company Filing History:
Years Active: 2014-2023
Title: The Innovations of Shih-Yi Syu
Introduction
Shih-Yi Syu is a prominent inventor based in Daxi, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work focuses on enhancing thermal dissipation in advanced integrated circuit structures.
Latest Patents
One of his latest patents is titled "Thermal dissipation through seal rings in 3DIC structure." This invention involves a die that includes a semiconductor substrate, a through-via penetrating through the semiconductor substrate, a seal ring overlying and connected to the through-via, and an electrical connector underlying the semiconductor substrate that is electrically coupled to the seal ring through the through-via. This innovative approach aims to improve thermal management in 3D integrated circuits.
Career Highlights
Shih-Yi Syu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise and innovative mindset have positioned him as a key player in the development of cutting-edge technologies.
Collaborations
Throughout his career, Shih-Yi has collaborated with notable colleagues, including Jing-Cheng Lin and Chung Yu Wang. These partnerships have fostered a creative environment that encourages the exchange of ideas and advancements in semiconductor technology.
Conclusion
Shih-Yi Syu's contributions to the field of semiconductor technology are noteworthy, particularly his innovative approaches to thermal dissipation in integrated circuits. His work continues to influence the industry and pave the way for future advancements.