Taiwan Semiconductor Manufacturing Comp. Ltd.

Shih-Yi Syu

Jing-Cheng Lin

Chung Yu Wang

Jui-Pin Hung

Chih-Hao Chen

Chin-Fu Kao

Chin-Chuan Chang

Hsien-Wen Liu

Yi-Chao Mao

Kung-Chen Yeh

Long Hua Lee

Yi-Lin Tsai

Chun-Hsing Su

Ying-Tz Hung

A die includes a semiconductor substrate, a through-via penetrating through the semiconductor substrate, a seal ring overlying and connected to the through-via, and an electrical connector underlying the semiconductor substrate and electrically coupled to the seal ring through the through-via.

Thermal dissipation through seal rings in 3DIC structure

A device includes a package component, and a die over and bonded to the package component. The die includes a substrate. A heat sink is disposed over and bonded to a back surface of the substrate through direct bonding.

Structures and formation methods of packages with heat sinks

A method includes performing a dicing on a composite wafer including a plurality of dies, wherein the composite wafer is bonded on a carrier when the step of dicing is performed. After the step of dicing, the composite wafer is mounted onto a tape. The carrier is then de-bonded from the composite wafer and the first tape.

Methods for de-bonding carriers

Growing community of inventors

Daxi, Taiwan

Shih-Yi Syu