Chun-Hsing Su

Title: **Innovative Contributions of Chun-Hsing Su in Semiconductor Technology**

Introduction

Chun-Hsing Su, a prominent inventor based in New Taipei, Taiwan, has significantly contributed to the field of semiconductor technology with a total of five patents to his name. His innovative work focuses on enhancing the functionality and efficiency of semiconductor devices, showcasing his expertise and dedication to advancement in this critical industry.

Latest Patents

Chun-Hsing Su's latest inventions include groundbreaking patents that address key aspects of device packaging. One notable patent is for "Fan-out packages and methods of forming same." This invention features a device package comprising a semiconductor die, a molding compound that extends along the die's sidewalls, and a planarizing polymer layer that covers the molding compound. The intricate design incorporates different sizes of fillers, optimizing the packaging process while ensuring efficient electrical connections through fan-out redistribution layers (RDLs).

Another remarkable patent from Chi-Hsing is related to "Grinding wheel design with elongated teeth arrangement." This innovative grinding wheel features a base disk with multiple protruding teeth, arranged in alignment with an elongated ring that encircles the center. This unique design enhances the grinding efficiency, showcasing Chun-Hsing's ability to blend practicality with innovation.

Career Highlights

Chun-Hsing Su works for Taiwan Semiconductor Manufacturing Company Ltd., a leader in semiconductor manufacturing. His experience in this advanced technological environment has allowed him to explore new ideas and work on cutting-edge projects, contributing to numerous advancements in semiconductor devices.

Collaborations

Throughout his career, Chun-Hsing has collaborated with notable colleagues such as Jing-Cheng Lin and Yi-Chao Mao. These collaborations have played a vital role in the development of his patented technologies, fostering an environment of creativity and innovation within the semiconductor industry.

Conclusion

Chun-Hsing Su’s innovative contributions have made a lasting impact on semiconductor technology. With five patents under his belt, including advancements in device packaging and grinding wheel design, he continues to lead in the pursuit of novel solutions that drive the industry forward. His work not only enhances the efficiency of semiconductor devices but also sets a benchmark for future innovations in the field.