Taiwan Semiconductor Manufacturing Comp. Ltd.

Chun-Hsing Su

Jing-Cheng Lin

Jui-Pin Hung

Chih-Hao Chen

Chung Yu Wang

Yi-Chao Mao

Kung-Chen Yeh

Long Hua Lee

Yi-Lin Tsai

Tsei-Chung Fu

Chin-Fu Kao

Chin-Chuan Chang

Hsien-Wen Liu

Shih-Yi Syu

Jeffrey Chang

Wen-Hua Chang

Ying-Tz Hung

An embodiment a device package includes a semiconductor die, a molding compound extending along sidewalls of the semiconductor die, and a planarizing polymer layer over the molding compound and extending along the sidewalls of the semiconductor die. The molding compound includes first fillers, and the planarizing polymer layer includes second fillers smaller than the first fillers. The device package further includes one or more fan-out redistribution layers (RDLs) electrically connected to the semiconductor die, wherein the one or more fan-out RDLs extend past edges of the semiconductor die onto a top surface of the planarizing polymer layer.

Fan-out packages and methods of forming same

A grinding wheel includes a base disk, and a plurality of teeth protruding beyond a surface of the base disk. The plurality of teeth is aligned to an elongated ring encircling a center of the grinding wheel.

Grinding wheel design with elongated teeth arrangement

A wafer level package includes a semiconductor die bonded on a supporting wafer. The semiconductor die has at least a step recess at its substrate. An underfill layer is formed between the semiconductor die and the supporting wafer. Moreover, the height of the underfill layer is limited by the step recess. During a fabrication process of the wafer level package, the step recess helps to reduce the stress on the wafer level package.

Package for three dimensional integrated circuit

A method includes performing a dicing on a composite wafer including a plurality of dies, wherein the composite wafer is bonded on a carrier when the step of dicing is performed. After the step of dicing, the composite wafer is mounted onto a tape. The carrier is then de-bonded from the composite wafer and the first tape.

Methods for de-bonding carriers

Growing community of inventors

Taipei, Taiwan

Chun-Hsing Su