IDiyas

For the Inventor, By the Inventor

Hsinchu, Taiwan

Chun-I Tsai

USPTO Granted Patents = 27 

Average Co-Inventor Count = 5.9

ph-index = 3

Forward Citations = 26(Granted Patents)


Company Filing History:

goldMedal27 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2015-2025

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27 patents (USPTO):
1. 12400853 - Method of forming conductive feature including cleaning step (2025-08-26),
2. 12327788 - Gate to source drain interconnects (2025-06-10),
3. 12148659 - Contact conductive feature formation and structure (2024-11-19),
4. 12057397 - Capping layer for liner-free conductive structures (2024-08-06),
5. 12020981 - Conductive feature formation and structure (2024-06-25),
6. 11955379 - Metal adhesion layer to promote metal plug adhesion (2024-04-09),
7. 11955329 - Method of forming conductive feature including cleaning step (2024-04-09),
8. 11929314 - Interconnect structures including a fin structure and a metal cap (2024-03-12),
9. 11817384 - Interconnect structure and manufacturing method for the same (2023-11-14),
10. 11798843 - Conductive feature formation and structure (2023-10-24),
11. 11676859 - Contact conductive feature formation and structure (2023-06-13),
12. 11670499 - Method of forming conductive feature including cleaning step (2023-06-06),
13. 11594609 - Liner-free conductive structures (2023-02-28),
14. 11521929 - Capping layer for liner-free conductive structures (2022-12-06),
15. 11217524 - Interconnect structure and manufacturing method for the same (2022-01-04),

Title: The Innovative Journey of Chun-I Tsai

Introduction:

Chun-I Tsai is a distinguished inventor hailing from Hsinchu, Taiwan. His groundbreaking work in the field of technology has earned him recognition on a global scale.

Latest Patents:

Chun-I Tsai's most recent patents focus on advancements in semiconductor technology, particularly in the development of cutting-edge microchips with enhanced performance capabilities.

Career Highlights:

With a career spanning over two decades, Chun-I Tsai has held key roles in various tech companies, contributing significantly to the evolution of the industry. His expertise lies in the areas of nanotechnology and materials science, where he has pioneered several innovative solutions.

Collaborations:

Throughout his career, Chun-I Tsai has collaborated with leading research institutions and universities to further his research and bring his inventions to life. His partnerships have been instrumental in pushing the boundaries of technological innovation.

Conclusion:

In conclusion, Chun-I Tsai's relentless pursuit of innovation and his passion for pushing the limits of technology have solidified his position as a trailblazer in the field. His contributions continue to inspire future generations of inventors and researchers in Taiwan and beyond.

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