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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chun-I Tsai

This inventor holds 30 USPTO granted patents and 15 published patent applications, primarily in Semiconductor Fabrication. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-I Tsai. Retrieved from https://idiyas.com/inventor/chun-i-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 30 

% Patents Active = 93.3

Average Co-Inventor Count = 6.1

ph-index = 3

Forward Citations = 28(Granted Patents)


Company Filing History:

goldMedal28 out of 42,965 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal2 out of 503 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2015-2026

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Areas of Expertise:
Fin Field-Effect Transistor
Liner-Free Conductive Structures
Conductive Feature Formation
Interconnect Structures
Metal Adhesion Layer
Capping Layer
Semiconductor Contact Structure
Integrated Circuit Fabrication
Gap Filling Improvement
Opening Fill Process
Contact Structure
Manufacturing Method
30 patents (USPTO):Explore Patents
1. 12765408 - Method of manufacturing an interconnect structure with a metal cap (2026-10-13),
2. 12677461 - Fin field-effect transistor device and methods of forming (2026-07-07),
3. 12588268 - Liner-free conductive structures (2026-03-24),
4. 12400853 - Method of forming conductive feature including cleaning step (2025-08-26),
5. 12327788 - Gate to source drain interconnects (2025-06-10),
6. 12148659 - Contact conductive feature formation and structure (2024-11-19),
7. 12057397 - Capping layer for liner-free conductive structures (2024-08-06),
8. 12020981 - Conductive feature formation and structure (2024-06-25),
9. 11955379 - Metal adhesion layer to promote metal plug adhesion (2024-04-09),
10. 11955329 - Method of forming conductive feature including cleaning step (2024-04-09),
11. 11929314 - Interconnect structures including a fin structure and a metal cap (2024-03-12),
12. 11817384 - Interconnect structure and manufacturing method for the same (2023-11-14),
13. 11798843 - Conductive feature formation and structure (2023-10-24),
14. 11676859 - Contact conductive feature formation and structure (2023-06-13),
15. 11670499 - Method of forming conductive feature including cleaning step (2023-06-06),

Title: The Innovative Journey of Chun-I Tsai

Introduction:

Chun-I Tsai is a distinguished inventor hailing from Hsinchu, Taiwan. His groundbreaking work in the field of technology has earned him recognition on a global scale.

Latest Patents:

Chun-I Tsai's most recent patents focus on advancements in semiconductor technology, particularly in the development of cutting-edge microchips with enhanced performance capabilities.

Career Highlights:

With a career spanning over two decades, Chun-I Tsai has held key roles in various tech companies, contributing significantly to the evolution of the industry. His expertise lies in the areas of nanotechnology and materials science, where he has pioneered several innovative solutions.

Collaborations:

Throughout his career, Chun-I Tsai has collaborated with leading research institutions and universities to further his research and bring his inventions to life. His partnerships have been instrumental in pushing the boundaries of technological innovation.

Conclusion:

In conclusion, Chun-I Tsai's relentless pursuit of innovation and his passion for pushing the limits of technology have solidified his position as a trailblazer in the field. His contributions continue to inspire future generations of inventors and researchers in Taiwan and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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