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For the Inventor, By the Inventor

Taipei, Taiwan

Chun-Han Tsao

USPTO Granted Patents = 15

Average Co-Inventor Count = 6.5

ph-index = 3

Forward Citations = 18(Granted Patents)


Company Filing History:

goldMedal15 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2015-2023

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15 patents (USPTO):
1. 11735635 - Semiconductor device and fabrication method thereof (2023-08-22),
2. 11276587 - Wafer bonding method and apparatus with curved surfaces (2022-03-15),
3. 11069785 - Semiconductor device and fabrication method thereof (2021-07-20),
4. 10840287 - 3DIC interconnect apparatus and method (2020-11-17),
5. 10535568 - Method for manufacturing multi-voltage devices using high-K-metal-gate (HKMG) technology (2020-01-14),
6. 10504756 - Wafer processing method and apparatus (2019-12-10),
7. 10361234 - 3DIC interconnect apparatus and method (2019-07-23),
8. 10276678 - Semiconductor device and fabrication method thereof (2019-04-30),
9. 10177043 - Method for manufacturing multi-voltage devices using high-K-metal-gate (HKMG) technology (2019-01-08),
10. 9941320 - 3DIC interconnect apparatus and method (2018-04-10),
11. 9837291 - Wafer processing method and apparatus (2017-12-05),
12. 9754827 - Semiconductor device and fabrication method thereof (2017-09-05),
13. 9293392 - 3DIC interconnect apparatus and method (2016-03-22),
14. 9252296 - Semiconductor device with compressive layers (2016-02-02),
15. 9059057 - Image sensor having compressive layers (2015-06-16),

Title: Innovator Spotlight: Chun-Han Tsao

Introduction:

Chun-Han Tsao, a talented inventor based in New Taipei, Taiwan, has established himself as a leading figure in the field of semiconductor technology. With an impressive portfolio of 15 patents to his name, Chun-Han Tsao continues to push the boundaries of innovation in the industry.

Latest Patents:

1. Semiconductor Device and Fabrication Method Thereof: Chun-Han Tsao's latest patent showcases a semiconductor device with a unique structure, dielectric layer, metal-semiconductor compound film, and cover layer. This innovative design sets a new standard in semiconductor fabrication methods.

2. Wafer Bonding Method and Apparatus with Curved Surfaces: Another one of Chun-Han Tsao's recent patents introduces an apparatus and method for bonding substrates using pre-warped wafers. This technique, utilizing curved surfaces, enables more precise bonding processes.

Career Highlights:

Chun-Han Tsao is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a prominent player in the semiconductor industry. His contributions to the company's research and development efforts have been invaluable, cementing his reputation as a skilled and forward-thinking inventor.

Collaborations:

Throughout his career, Chun-Han Tsao has collaborated closely with esteemed colleagues such as Yeur-Luen Tu and Chia-Shiung Tsai. Together, they have worked on various projects that have significantly impacted the semiconductor technology landscape.

Conclusion:

In conclusion, Chun-Han Tsao stands out as a visionary inventor whose groundbreaking work in semiconductor technology continues to shape the industry. With a keen eye for innovation and a dedication to excellence, he remains at the forefront of technological advancements, inspiring his peers and leaving a lasting impact on the field.

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