The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
May. 15, 2015
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chun-Han Tsao, New Taipei, TW;
Chih-Yu Lai, Tainan, TW;
Chih-Hui Huang, Yongkang, TW;
Cheng-Ta Wu, Shueishang Township, TW;
Yeur-Luen Tu, Taichung, TW;
Ching-Chun Wang, Tainan, TW;
Shyh-Fann Ting, Kaohsiung, TW;
Chia-Shiung Tsai, Hsinchu, TW;
Abstract
A semiconductor device includes a substrate having a first side and a second side opposite the first side. The substrate has a sensor region proximate the first side. The semiconductor device also includes a first compressive layer over the second side of the substrate. The semiconductor device further includes a light blocking element over the first compressive layer. The semiconductor device additionally includes a second compressive layer over the first compressive layer and covering a portion of the light blocking element. The semiconductor device also includes a third compressive layer between the second compressive layer and the portion of the light blocking element.