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For the Inventor, By the Inventor

Yongkang, Taiwan

Chih-Hui Huang

This inventor holds 47 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Manufacturing. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2013-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Hui Huang. Retrieved from https://idiyas.com/inventor/chih-hui-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 47 

% Patents Active = 89.4

Average Co-Inventor Count = 6.0

ph-index = 8

Forward Citations = 830(Granted Patents)


Location History:

  • Tainan, TW (2018 - 2021)
  • Tainan County, TW (2015 - 2022)
  • Yongkang, TW (2013 - 2024)

Company Filing History:

goldMedal46 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 465 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2013-2026

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Areas of Expertise:
Wafer Bonding
Deep Trench Isolation
Image Sensor
Hybrid Bonding
Stacked Device
Capping Layer
Conductive Pad
Substrate Surface Cleaning
Film Formation
Interconnect Structure
BSI Image Sensor
Composite Bond Structure
47 patents (USPTO):Explore Patents
1. 12557401 - Method of forming deep trench isolation in radiation sensing substrate and image sensor device (2026-02-17),
2. 12237165 - Method for wafer bonding including edge trimming (2025-02-25),
3. 12211741 - Multi-wafer capping layer for metal arcing protection (2025-01-28),
4. 12142628 - Method of forming semiconductor device (2024-11-12),
5. 11915977 - Interconnect structure for stacked device (2024-02-27),
6. 11862515 - Multi-wafer capping layer for metal arcing protection (2024-01-02),
7. 11610812 - Multi-wafer capping layer for metal arcing protection (2023-03-21),
8. 11404470 - Method of forming deep trench isolation in radiation sensing substrate and image sensor device (2022-08-02),
9. 11387274 - Method of forming semiconductor device (2022-07-12),
10. 11276587 - Wafer bonding method and apparatus with curved surfaces (2022-03-15),
11. 11189654 - Manufacturing methods of semiconductor image sensor devices (2021-11-30),
12. 11139210 - Bonding support structure (and related process) for wafer stacking (2021-10-05),
13. 11087971 - Method for manufacturing semiconductor device and manufacturing method of the same (2021-08-10),
14. 11041242 - Gas shower head with plural hole patterns and with corresponding different plural hole densities and film formation method (2021-06-22),
15. 10978345 - Interconnect structure for stacked device (2021-04-13),

Title: The Innovative Journey of Chih-Hui Huang

Introduction: Chih-Hui Huang, a talented inventor hailing from Yongkang, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Huang's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar-powered devices for sustainable living.

Career Highlights: With a career spanning over two decades, Huang has worked tirelessly to bring his ideas to life, holding multiple patents in the areas of clean energy, smart home devices, and medical technology.

Collaborations: Throughout his career, Huang has collaborated with leading research institutions and tech companies to further his inventions, showcasing his ability to work effectively in multidisciplinary teams.

Conclusion: Chih-Hui Huang's dedication to innovation and his passion for creating a more sustainable future through technology make him a standout figure in the world of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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