The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 22, 2021

Filed:

Jan. 06, 2020
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Chih-Hui Huang, Tainan County, TW;

Sheng-Chan Li, Tainan, TW;

Cheng-Hsien Chou, Tainan, TW;

Cheng-Yuan Tsai, Hsin-Chu County, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); C23C 16/455 (2006.01); H01L 23/00 (2006.01); C23C 16/458 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45565 (2013.01); C23C 16/4583 (2013.01); C23C 16/45568 (2013.01); H01L 21/02107 (2013.01); H01L 21/68714 (2013.01); H01L 24/02 (2013.01); H01L 2224/0236 (2013.01); H01L 2224/02317 (2013.01);
Abstract

A gas shower head includes a plate, a plurality of central holes disposed in a central region of the plate, and a plurality of peripheral holes disposed in a peripheral region of the plate. The central holes are configured to form a first portion of a material film, and the peripheral holes are configured to form a second portion of the material film. A hole density in the peripheral region is greater than a hole density in the central region. The first portion of the material film includes a first thickness corresponding to the hole density in central region, and the second portion of the material film includes a second thickness corresponding to the hole density in peripheral region and greater than the first thickness.


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