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St. Remy les Chevreuse, France

Christian Val

USPTO Granted Patents = 41 (Patent Applications = 1)

EPO Patents = 15 (Patent Applications = 6)

Average Co-Inventor Count = 1.2

ph-index = 18

Forward Citations = 755(Granted Patents)

Location History:

78470 St Remy les Chevreuse, FR (1985)
St. Remy les Chevreuses, FR (1985 - 1993)
Paris, FR (1980 - 1996)
St Remy les Chevreuses, FR (1994 - 1998)
St. Remy les Chevreuse, FR (1995 - 2013)
Ville, FR (2015)
Saint Remy les Chevreuse, FR (2018)
Saint-Rémy-lès-Chevreuse, FR (2019)
St Remy les Chevreuse, FR (1997 - 2023)

Company Filing History:

14 out of 2,692

Compagnie D'informatique Militaire Spatiale Et Aeronautique

Compagnie D'informatique Militaire Spatiale & Aeronautique

6. 2 out of 832,812

Other

patents

Years Active: 1980-2023

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Areas of Expertise:

High-Frequency Electronic Modules

Wafer-Scale Fabrication

3D Electronic Modules

Chip Interconnection

Vertical Interconnection

Heterogeneous Components

Hermetic Encapsulation

Thermal Printing Heads

Moisture-Retention Elements

Composite Substrates

Radiation-Hardened Casings

Electronic Device Packaging

41 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11587911 - Process for producing a high-frequency-compatible electronic module (2023-02-21),

2. 10483180 - Process for the wafer-scale fabrication of hermetic electronic modules (2019-11-19),

3. 10332863 - Method of miniaturized chip on chip interconnection of a 3D electronic module (2019-06-25),

4. 10064278 - 3D electronic module comprising a ball grid array stack (2018-08-28),

5. 9899250 - Method of collective fabrication of 3D electronic modules configured to operate at more than 1 GHz (2018-02-20),

6. 9111688 - Method for producing reconstituted wafers with support of the chips during their encapsulation (2015-08-18),

7. 8735220 - Method for positioning chips during the production of a reconstituted wafer (2014-05-27),

8. 8716036 - Method for collective fabrication of 3D electronic modules comprising only validated PCBs (2014-05-06),

9. 8567051 - Process for the vertical interconnection of 3D electronic modules by vias (2013-10-29),

10. 8546190 - Method for positioning chips during the production of a reconstituted wafer (2013-10-01),

11. 8359740 - Process for the wafer-scale fabrication of electronic modules for surface mounting (2013-01-29),

12. 8264853 - 3D electronic module (2012-09-11),

13. 8243468 - Low-thickness electronic module comprising a stack of electronic packages provided with connection balls (2012-08-14),

14. 8136237 - Method of interconnecting electronic wafers (2012-03-20),

15. 7951649 - Process for the collective fabrication of 3D electronic modules (2011-05-31),

Title: Christian Val - Innovative Inventor from St Remy les Chevreuse, FR

Introduction: Christian Val is a renowned inventor hailing from St Remy les Chevreuse, France, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Christian Val holds several patents in the areas of renewable energy, sustainable transportation, and smart home technologies, showcasing his commitment to creating a more efficient and eco-friendly world.

Career Highlights: With a career spanning over two decades, Christian Val has worked with leading research institutions and tech companies to develop cutting-edge solutions that have revolutionized various industries. His innovative mindset and dedication to excellence have earned him recognition as a pioneer in the field of technology.

Collaborations: Throughout his career, Christian Val has collaborated with top engineers, scientists, and designers to bring his ideas to life. His ability to work effectively in multidisciplinary teams has led to the successful implementation of numerous projects that have had a lasting impact on society.

Conclusion: Christian Val's passion for innovation and his relentless pursuit of excellence continue to drive him to push the boundaries of what is possible. His contributions to the world of technology have not only improved the quality of life for many but have also inspired the next generation of inventors to dream big and create a better future.

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