The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2019
Filed:
Dec. 01, 2017
Applicant:
Packaging Sip, Saint-Rémy-lès-Chevreuse, FR;
Inventors:
Christian Val, Saint-Rémy-lès-Chevreuse, FR;
Alexandre Val, Le Chesnay, FR;
Assignee:
PACKAGING SIP, Saint-Rémy-lès-Chevreuse, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3135 (2013.01); H01L 23/3128 (2013.01); H01L 23/49894 (2013.01); H01L 23/552 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01);
Abstract
An electronic module including one or more electronic components that are electrically connected to a multilayer PCB circuit comprises, on one face, electrical connection balls for the external electrical connection of the electronic module. The PCB circuit comprises a hermetically protective electrically insulating inorganic inner layer, and the module comprises six faces with an electrically insulating or conductive inorganic hermetic protection layer on the five faces other than that formed by the PCB circuit.