The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2015
Filed:
May. 04, 2012
Christian Val, Ville, FR;
Christian Val, Ville, FR;
3D PLUS, Buc, FR;
Abstract
A method for collectively fabricating a reconstituted wafer comprising chips exhibiting connection pads on a front face of the chip, comprises: positioning the chips on an initial adhesive support, front face on the support, vapor deposition at atmospheric pressure and ambient temperature, of an electrically insulating layer on the initial support and the chips, having a mechanical role of holding the chips, transfer of the chips covered with the mineral layer onto a provisional adhesive support, rear face of the chips toward this provisional adhesive support, removal of the initial adhesive support, overlaying the chips onto a support of 'chuck' type, front faces of the chips toward this support, removal of the provisional adhesive support, deposition of a resin on the support of 'chuck' type to encapsulate the chips, and then polymerization of the resin, removal of the support of “chuck” type, production of an RDL layer active face side.