For the Inventor, By the Inventor

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3D Plus

USPTO Granted Patents = 25

EPO Patents = 23

Forward Citations = 128

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11 inventors (with patents filed for the assignee):

Christian Val (19 out of 41 patents)

Olivier Lignier (3 out of 3 patents)

Alexandre Val (2 out of 3 patents)

4. Cédric Colonna (2 out of 2 patents)

5. Mohamed Boussadia (1 out of 1 patent)

6. Patrick Dubus (1 out of 1 patent)

7. Nicolas Perrot (1 out of 1 patent)

8. Didier Gambart (1 out of 1 patent)

9. Fabrice Soufflet (1 out of 1 patent)

10. Pascal Couderc (1 out of 1 patent)

11. Regis Bocage (1 out of 1 patent)

12. Olivier Limousin (2 patents)

13. Christian Thales Int Prop Val (0 patent)

14. Christian Thales Intellectual Property Val (0 patent)

25 patents: Sort by Forward Citations

1. 12586708 - Innovative planar electromagnetic component structure (2026-03-24),

2. 11594972 - Resonant power converter (2023-02-28),

3. 11587911 - Process for producing a high-frequency-compatible electronic module (2023-02-21),

4. 11067621 - Apparatus for burning in electronic components (2021-07-20),

5. 10727748 - High frequency DC voltage converter of the quasi-resonant buck type (2020-07-28),

6. 10466097 - 3D imaging optoelectronic module (2019-11-05),

7. 10332863 - Method of miniaturized chip on chip interconnection of a 3D electronic module (2019-06-25),

8. 10064278 - 3D electronic module comprising a ball grid array stack (2018-08-28),

9. 9899250 - Method of collective fabrication of 3D electronic modules configured to operate at more than 1 GHz (2018-02-20),

10. 9659846 - Process for manufacturing a 3D electronic module comprising external interconnection leads (2017-05-23),

11. 9111688 - Method for producing reconstituted wafers with support of the chips during their encapsulation (2015-08-18),

12. 8735220 - Method for positioning chips during the production of a reconstituted wafer (2014-05-27),

13. 8716036 - Method for collective fabrication of 3D electronic modules comprising only validated PCBs (2014-05-06),

14. 8567051 - Process for the vertical interconnection of 3D electronic modules by vias (2013-10-29),

15. 8546190 - Method for positioning chips during the production of a reconstituted wafer (2013-10-01),

3D PLUS is a leading provider of advanced high-density 3D microelectronic products and systems for aerospace, defense, industrial, and medical applications. With over 30 years of experience, the company specializes in the design, development, and manufacturing of robust and miniaturized electronic solutions. 3D PLUS offers a wide range of products including memory modules, image sensors, data converters, and system-on-modules. Their innovative technologies enable customers to enhance performance, reduce size, and improve reliability in their electronic systems.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 15 2026

25 Patents

#2 in Buc

#839 in France

#25,617 in the World

3D Plus

Forward Citations = 128

11 inventors:

Christian Val (19 out of 41 patents)

Olivier Lignier (3 out of 3 patents)

Alexandre Val (2 out of 3 patents)

4. Cédric Colonna (2 out of 2 patents)

5. Mohamed Boussadia (1 out of 1 patent)

Please report any incorrect information to [email protected]

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