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3D Plus

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USPTO Granted Patents = 25

EPO Patents = 23

Forward Citations = 129

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11 inventors (with patents filed for the assignee):

Christian Val (19 out of 41 patents)

Olivier Lignier (3 out of 3 patents)

Alexandre Val (2 out of 3 patents)

4. Cédric Colonna (2 out of 2 patents)

5. Mohamed Boussadia (1 out of 1 patent)

6. Patrick Dubus (1 out of 1 patent)

7. Nicolas Perrot (1 out of 1 patent)

8. Didier Gambart (1 out of 1 patent)

9. Fabrice Soufflet (1 out of 1 patent)

10. Pascal Couderc (1 out of 1 patent)

11. Regis Bocage (1 out of 1 patent)

12. Olivier Limousin (2 patents)

13. Christian Thales Int Prop Val (0 patent)

14. Christian Thales Intellectual Property Val (0 patent)

Core Competencies:

Planar Electromagnetic Component

Resonant Power Converter

High-Frequency Electronic Module

3D Imaging Optoelectronic Module

Chip on Chip Interconnection

Ball Grid Array Stack

Vertical Interconnection

Wafer-Scale Fabrication

Thin Heterogeneous Component

Integrated Heat Distributor

Collective Fabrication

Three Dimensional Interconnection

25 patents: Sort by Forward Citations

1. 12586708 - Innovative planar electromagnetic component structure (2026-03-24),

2. 11594972 - Resonant power converter (2023-02-28),

3. 11587911 - Process for producing a high-frequency-compatible electronic module (2023-02-21),

4. 11067621 - Apparatus for burning in electronic components (2021-07-20),

5. 10727748 - High frequency DC voltage converter of the quasi-resonant buck type (2020-07-28),

6. 10466097 - 3D imaging optoelectronic module (2019-11-05),

7. 10332863 - Method of miniaturized chip on chip interconnection of a 3D electronic module (2019-06-25),

8. 10064278 - 3D electronic module comprising a ball grid array stack (2018-08-28),

9. 9899250 - Method of collective fabrication of 3D electronic modules configured to operate at more than 1 GHz (2018-02-20),

10. 9659846 - Process for manufacturing a 3D electronic module comprising external interconnection leads (2017-05-23),

11. 9111688 - Method for producing reconstituted wafers with support of the chips during their encapsulation (2015-08-18),

12. 8735220 - Method for positioning chips during the production of a reconstituted wafer (2014-05-27),

13. 8716036 - Method for collective fabrication of 3D electronic modules comprising only validated PCBs (2014-05-06),

14. 8567051 - Process for the vertical interconnection of 3D electronic modules by vias (2013-10-29),

15. 8546190 - Method for positioning chips during the production of a reconstituted wafer (2013-10-01),

Company Overview

3D Plus is a French company specializing in the design and manufacture of advanced 3D microelectronic solutions. The organization focuses on developing innovative products for various sectors, including aerospace, defense, and telecommunications. With a commitment to cutting-edge technology, 3D Plus excels in creating high-density packaging and miniaturized components that enhance the performance and reliability of electronic systems. Its expertise in microelectronics positions it as a key player in the global market, particularly within Europe.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

25 Patents

#2 in Buc

#843 in France

#25,748 in the World

3D Plus

Forward Citations = 129

11 inventors:

Christian Val (19 out of 41 patents)

Olivier Lignier (3 out of 3 patents)

Alexandre Val (2 out of 3 patents)

4. Cédric Colonna (2 out of 2 patents)

5. Mohamed Boussadia (1 out of 1 patent)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: 3D Plus. Retrieved from https://idiyas.com/company/3d-plus

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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