The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2018
Filed:
Jun. 23, 2016
Applicant:
3d Plus, Buc, FR;
Inventor:
Christian Val, St Remy les Chevreuse, FR;
Assignee:
3D PLUS, Buc, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H01L 23/538 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/18 (2013.01); H01L 23/5384 (2013.01); H01L 23/5387 (2013.01); H01L 23/5389 (2013.01); H01L 23/66 (2013.01); H01L 24/00 (2013.01); H01L 25/105 (2013.01); H05K 1/147 (2013.01); H05K 1/189 (2013.01); H01L 23/49816 (2013.01);
Abstract
A 3D electronic module comprises: two electrically tested electronic packages, each comprising at least one encapsulated chip and output balls on a single face of the package, referred to as the main face; two flexible circuits that are mechanically connected to one another, each being associated with a package, and which are positioned between the two packages, each flexible circuit comprising: on one face, first electrical interconnect pads facing the output balls of the associated package; at its end, a portion that is folded over a lateral face of the associated package; second electrical interconnect pads on the opposite face of this folded portion.